Minoru Maruyama

TL;DR: The liquid water thickness at an ice/silica interface in frozen porous silica has been measured with pulsed NMR in a temperature range of −30 to 0°C as mentioned in this paper.

TL;DR: In this paper, a lead-free nano-silver paste was used to connect silicon diode chips to copper bases at 350°C in nitrogen ambient without external pressure, and the resulting diode packages had electrical and thermal properties about equal to those with lead-solder joints.

TL;DR: In this paper, phase equilibrium lines between an entirely liquid solution and a liquid solution in which water ice forms (liquidus lines) were determined for ammonia concentration by mass X equal to 0.034, 0.0472, α; and the product of density and gravity, ρg.

TL;DR: In this article, a silver-fatty acid complex was decomposed at 250 °C in a nitrogen atmosphere to make stable, mono-disperse silver nanoparticles The size distribution was measured using high-resolution transmission electron microscopy (HRTEM); the mean particle diameter was 47 nm and the standard deviation was 06 nm This size distribution is verified by the measured surface-plasmon absorption spectrum.

TL;DR: In this article, lead-free silver nanoparticle pastes have been tested as a replacement for high temperature lead-rich solders used in electronic manufacturing, and the pastes were used to connect a silicon diode chip to copper bases without applied pressure when sintered at 350°C under nitrogen.