M
Moyang Li
Researcher at University of Illinois at Urbana–Champaign
Publications - 8
Citations - 468
Moyang Li is an academic researcher from University of Illinois at Urbana–Champaign. The author has contributed to research in topics: RFIC & Layer (electronics). The author has an hindex of 5, co-authored 8 publications receiving 352 citations.
Papers
More filters
Journal ArticleDOI
Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics
Fu Haoran,Kewang Nan,Wubin Bai,Wen Huang,Ke Bai,Luyao Lu,Chaoqun Zhou,Yunpeng Liu,Fei Liu,Juntong Wang,Mengdi Han,Zheng Yan,Haiwen Luan,Yijie Zhang,Yutong Zhang,Jianing Zhao,Xu Cheng,Moyang Li,Jung Woo Lee,Yuan Liu,Daining Fang,Xiuling Li,Yonggang Huang,Yihui Zhang,John A. Rogers +24 more
TL;DR: A set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres is introduced.
Journal ArticleDOI
Three-dimensional radio-frequency transformers based on a self-rolled-up membrane platform
Wen Huang,Jingchao Zhou,Paul Froeter,Kathy Walsh,Siyu Liu,Mark D. Kraman,Moyang Li,Julian A. Michaels,Dane J. Sievers,Songbin Gong,Xiuling Li +10 more
TL;DR: On-chip radio-frequency transformers made from three-dimensional self-rolled-up coils offer both high performance and an ultra-compact device footprint and by using only planar processing.
Journal ArticleDOI
3D hierarchical architectures based on self-rolled-up silicon nitride membranes
Paul Froeter,Xin Yu,Wen Huang,Frank Du,Moyang Li,Iksu Chun,Seung Hyun Kim,Kuen J. Hsia,John A. Rogers,Xiuling Li +9 more
TL;DR: Compact 3D hierarchical architectures involving carbon nanotube arrays and passive electronic components are demonstrated by releasing the functional structures deposited and patterned in 2D, highlighting the uniqueness of this platform that exploits 2D processing and self-assembly to achieve highly functional 3D structures.
Journal ArticleDOI
Ultra-Small, High-Frequency, and Substrate-Immune Microtube Inductors Transformed from 2D to 3D
TL;DR: On-chip self-rolled-up 3D microtube inductors with extremely small footprint, unprecedented high frequency performance and weak dependence on substrate conductivity are reported.
Proceedings ArticleDOI
CMOS-compatible on-chip self-rolled-up inductors for RF/mm-wave applications
Wen Huang,Jingchao Zhou,Paul Froeter,Kathy Walsh,Siyu Liu,Julian A. Michaels,Moyang Li,Songbin Gong,Xiuling Li +8 more
TL;DR: In this paper, a self-rolled-up membrane (S-RuM) inductor based on on-chip copper (Cu) was demonstrated for the first time, and the achieved inductance is in the range from 0.3nH to 1nH.