Capacitive micromachined ultrasonic transducers (CMUTs) have been subject to extensive research for the last two decades. Although they were initially developed for air-coupled applications, today their main application space is medical imaging and therapy. This paper first presents a brief description of CMUTs, their basic structure and operating principles. Our progression of developing several generations of fabrication processes is discussed with an emphasis on the advantages and disadvantages of each process. Monolithic and hybrid approaches for integrating CMUTs with supporting integrated circuits are surveyed. Several prototype transducer arrays with integrated front-end electronic circuits we developed and their use for 2D and 3D, anatomical and functional imaging, and ablative therapies are described. The presented results prove the CMUT as a micro-electro-mechanical systems technology for many medical diagnostic and therapeutic applications.

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Capacitive micromachined ultrasonic transducers for medical imaging and therapy

Intravascular ultrasound (IVUS) and intracardiac echography (ICE) catheters with real-time volumetric ultrasound imaging capability can provide unique benefits to many interventional procedures used in the diagnosis and treatment of coronary and structural heart diseases. Integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with front-end electronics in single-chip configuration allows for implementation of such catheter probes with reduced interconnect complexity, miniaturization, and high mechanical flexibility. We implemented a single-chip forward-looking (FL) ultrasound imaging system by fabricating a 1.4-mm-diameter dual-ring CMUT array using CMUT-on-CMOS technology on a front-end IC implemented in 0.35-μm CMOS process. The dual-ring array has 56 transmit elements and 48 receive elements on two separate concentric annular rings. The IC incorporates a 25-V pulser for each transmitter and a low-noise capacitive transimpedance amplifier (TIA) for each receiver, along with digital control and smart power management. The final shape of the silicon chip is a 1.5-mm-diameter donut with a 430-μm center hole for a guide wire. The overall front-end system requires only 13 external connections and provides 4 parallel RF outputs while consuming an average power of 20 mW. We measured RF A-scans from the integrated single- chip array which show full functionality at 20.1 MHz with 43% fractional bandwidth. We also tested and demonstrated the image quality of the system on a wire phantom and an ex vivo chicken heart sample. The measured axial and lateral point resolutions are 92 μm and 251 μm, respectively. We successfully acquired volumetric imaging data from the ex vivo chicken heart at 60 frames per second without any signal averaging. These demonstrative results indicate that single-chip CMUT-on-CMOS systems have the potential to produce realtime volumetric images with image quality and speed suitable for catheter-based clinical applications.

Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging

This paper describes the design of CMOS receiver electronics for monolithic integration with capacitive micromachined ultrasonic transducer (CMUT) arrays for high-frequency intravascular ultrasound imaging. A custom 8-inch (20-cm) wafer is fabricated in a 0.35-μm two-poly, four-metal CMOS process and then CMUT arrays are built on top of the application specific integrated circuits (ASICs) on the wafer. We discuss advantages of the single-chip CMUT-on-CMOS approach in terms of receive sensitivity and SNR. Low-noise and high-gain design of a transimpedance amplifier (TIA) optimized for a forward-looking volumetric-imaging CMUT array element is discussed as a challenging design example. Amplifier gain, bandwidth, dynamic range, and power consumption trade-offs are discussed in detail. With minimized parasitics provided by the CMUT-on-CMOS approach, the optimized TIA design achieves a 90 fA/√Hz input-referred current noise, which is less than the thermal-mechanical noise of the CMUT element. We show successful system operation with a pulseecho measurement. Transducer-noise-dominated detection in immersion is also demonstrated through output noise spectrum measurement of the integrated system at different CMUT bias voltages. A noise figure of 1.8 dB is obtained in the designed CMUT bandwidth of 10 to 20 MHz.

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Front-end receiver electronics for high-frequency monolithic CMUT-on-CMOS imaging arrays

This review is about the development of three-dimensional (3D) ultrasonic medical imaging, how it works, and where its future lies. It assumes knowledge of two-dimensional (2D) ultrasound, which is covered elsewhere in this issue. The three main ways in which 3D ultrasound may be acquired are described: the mechanically swept 3D probe, the 2D transducer array that can acquire intrinsically 3D data, and the freehand 3D ultrasound. This provides an appreciation of the constraints implicit in each of these approaches together with their strengths and weaknesses. Then some of the techniques that are used for processing the 3D data and the way this can lead to information of clinical value are discussed. A table is provided to show the range of clinical applications reported in the literature. Finally, the discussion relating to the technology and its clinical applications to explain why 3D ultrasound has been relatively slow to be adopted in routine clinics is drawn together and the issues that will govern its development in the future explored.

Three-dimensional ultrasound imaging

This paper demonstrates a four-channel transceiver chip for medical ultrasonic imaging, interfacing to the capacitive micromachined ultrasonic transducers (CMUTs). The high-voltage transmitter (Tx) uses a three-level pulse-shaping technique with charge recycling to improve the power efficiency. The design requires minimum off-chip components and is scalable for more channels. The receiver is implemented with a transimpedance amplifier (TIA) topology and is optimized for tradeoffs between noise, bandwidth, and power dissipation. The test chip is characterized with both acoustic and electrical measurements. Comparing the three-level pulser against traditional two-level pulsers, the measured Tx efficiency shows 56%, 50%, and 43% more acoustic power delivery with the same total power dissipation at 2.5, 3.3, and 5.0 MHz, respectively. The CMUT receiver achieves the lowest noise efficiency factor compared with that of the literature (2.1 compared to a previously reported lowest of 3.6, in units of mPA ·√(mW/Hz). In addition, the transceiver chip is tested as a complete system for medical ultrasound imaging applications, in experiments including Tx beamformation, pulse-echo channel response characterization, and ultrasonic Doppler flow rate detection.

/pdf/ultrasonic-imaging-transceiver-design-for-cmut-a-three-level-4e8znri4g6.pdf

Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver

State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16times16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated properly timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (Bscans) of a latex heart phantom.

An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

The cost and complexity of medical ultrasound imaging systems can be reduced by integrating the transducer array with an integrated circuit (IC). By incorporating some of the system's front-end electronics into an IC, bulky cables and costly system electronics can be eliminated. Here we present an IC for 3D intracavital imaging that requires few electrical connections but uses a large fraction of a 16times16-element 2D transducer array to transmit focused ultrasound. To simplify the receive and data acquisition electronics, only the 32 elements along the array diagonals are used as receivers. The IC provides a preamplifier for each receiving element. Each of the 224 transmitting elements is provided an 8-bit shift register, a comparator, and a 25-V pulser. To transmit, a global counter is incremented from 1 to 224; each pulser fires when its stored register value is equal to the global count value. Electrical testing of the fabricated IC shows that it works as designed. The IC was flip-chip bonded to a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. A two-dimensional image of a wire target phantom was acquired.

N. Jamal

Papers

An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

2C-3 An Integrated Circuit with Transmit Beamforming and Parallel Receive Channels for 3D Ultrasound Imaging: Testing and Characterization