O
Orlando Escorcia
Researcher at Axcelis Technologies
Publications - 29
Citations - 1811
Orlando Escorcia is an academic researcher from Axcelis Technologies. The author has contributed to research in topics: Dielectric & Curing (chemistry). The author has an hindex of 17, co-authored 29 publications receiving 1809 citations.
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Patent
Ultraviolet curing processes for advanced low-k materials
TL;DR: In this article, the process of making such materials involves providing a dielectric material and ultraviolet (UV) curing the material to produce a UV-cured, low-dielectric constant materials with improved elastic modulus and material hardness.
Patent
Plasma curing process for porous low-k materials
Ralph Albano,Cory Bargeron,Iii Ivan L. Berry,Jeff Bremmer,Phil Dembowski,Orlando Escorcia,Qinyuan Han,Nick Sbrockey,Carlo Waldfried +8 more
TL;DR: In this paper, a post-plasma treatment of the plasma cured porous dielectric material reduces the dielectrics constant of the material while maintaining an improved elastic modulus and film hardness.
Patent
Plasma curing of MSQ-based porous low-k film materials
TL;DR: In this paper, a porous methyl silsesquioxane-based dielectric film material is used to convert the porous material into porous silica, and the material is plasma cured for between about 15 and about 120 seconds at a temperature less than or about 350 °C.
Patent
Front end of line plasma mediated ashing processes and apparatus
TL;DR: In this paper, a front end line (FEOL) plasma mediated ashing process for removing organic material from a substrate generally includes exposing the substrate to the plasma to selectively remove photoresist, implanted photoresists, polymers and/or residues from the substrate.
Patent
Ultraviolet assisted pore sealing of porous low k dielectric films
TL;DR: In this paper, the surface of the porous low k material is sealed to a depth less than or equal to about 20 nanometers, wherein the surface is substantially free of pores after the UV exposure.