A high dynamic range and high precision broadband optical inspection system (1) and method are provided. The system provides capability of optical inspection of patterned and unpatterned substrates (27) in which a very large dynamic range with very high precision is desirable to provide detection of light scattering defects from sub micron to hundreds of microns in size. The system permits high throughput substrate inspection in which the sides, bevels and edges of the substrate may be rapidly or simultaneously inspected for defects.

High dynamic range optical inspection system and method

A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

Defect inspection method and apparatus

A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.

Surface inspection method and surface inspection apparatus

Components, systems, and methods for reducing location-based interference in distributed antenna systems operating in multiple-input, multiple-output (MIMO) configuration are disclosed. Interference is defined as issues with received MIMO communications signals that can cause a MIMO algorithm to not be able to solve a channel matrix for MIMO communications signals received by MIMO receivers in client devices. These issues may be caused by lack of spatial (i.e., phase) separation in the received MIMO communications signals. Thus, to provide phase separation of received MIMO communication signals, multiple MIMO transmitters are each configured to employ multiple transmitter antennas, which are each configured to transmit in different polarization states. In certain embodiments, one of the MIMO communications signals is phase shifted in one of the polarization states to provide phase separation between received MIMO communication signals. In other embodiments, multiple transmitter antennas in a MIMO transmitter can be offset to provide phase separation.

Reducing location-dependent interference in distributed antenna systems operating in multiple-input, multiple-output (MIMO) configuration, and related components, systems, and methods

A geometric measurement system is adapted to precisely measure one or more surfaces of objects such as corneas, molds, contact lenses in molds, contact lenses, or other objects in a fixture. The geometric measurement system can employ one or more of three possible methods of measurement: Shack-Hartmann wavefront sensing with wavefront stitching; phase diversity sensing; and white light interferometry.

Geometric measurement system and method of measuring a geometric characteristic of an object

Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Wafer inspection systems and methods for analyzing inspection data

A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.

Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

Darkfield inspection system having a programmable light selection array

PROBLEM TO BE SOLVED: To provide tools and methods for inspecting surface.SOLUTION: An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes light scattered according to an ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects of the workpiece onto a photosensor which converts the light into an electric signal. Processing circuitry receives the electric signal from the light detection element, and conducts surface analysis of the workpiece that can include characterization of the defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

Surface inspection devices and surface inspection methods

PROBLEM TO BE SOLVED: To provide a surface inspection tool and a method for the same.SOLUTION: An inspection tool in an embodiment includes a light irradiation source generating scattered light including scattered light from the defects of a workpiece, which caused by guiding a light beam on the workpiece, scattered light according to a normal scattering pattern of the workpiece. In the embodiment, a programmable light selective array is included, which receives light scattered from the work piece and selectively guide the light scattered from the defects of the workpiece to a photosensor that converts this light into an electric signal. A processing circuit receives the electric signal from the photosensor and makes surface analysis of the workpiece which may include the characterization of defects. The programmable light selective array may include a reflector array and a filter array, although not being limited to them. The present invention also includes associated surface inspection methods.

Paul J. Sullivan

Papers

Wafer inspection systems and methods for analyzing inspection data

Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

Darkfield inspection system having a programmable light selection array

Surface inspection devices and surface inspection methods

Surface inspection device and method for the same