P
Paul T. Vianco
Researcher at Sandia National Laboratories
Publications - 122
Citations - 2569
Paul T. Vianco is an academic researcher from Sandia National Laboratories. The author has contributed to research in topics: Soldering & Intermetallic. The author has an hindex of 23, co-authored 117 publications receiving 2448 citations.
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Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
D. R. Frear,Paul T. Vianco +1 more
TL;DR: In this paper, the growth and mechanical behavior of interfacial intermetallics between copper and six solder alloys commonly used in electronics assembly were examined. And the fracture behavior of the joints in tension was dependent upon the strength of the solder alloy.
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Issues in the replacement of lead-bearing solders
Paul T. Vianco,D. R. Frear +1 more
TL;DR: The use of soft solders, particularly those containing lead, dates back nearly 5,000 years as discussed by the authors, and is an important building block in the manufacture of high-speed computer assemblies.
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Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings
TL;DR: The growth kinetics of intermetallic compound layers formed between four hot-dipped solder coatings and copper by solid state, thermal aging were examined in this paper, where solders were l00Sn, 50In-50Sn, 100In, and 63Sn-37Pb (wt.%); the substrate material was oxygen free, high conductivity Cu.
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Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: experimental analysis
TL;DR: In this paper, the authors examined the solid state growth kinetics of the interfacial intermetallic compound layers formed between copper and the high temperature, tin-rich solders 96.5Sn-3.5Ag (wt.%) and 95Sn-5Sb.
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Properties of ternary Sn-Ag-Bi solder alloys: Part I-Thermal properties and microstructural analysis
Paul T. Vianco,Jerome A. Rejent +1 more
TL;DR: In this article, Bismuth additions of 1% to 10% were made to the 96.5Sn-3.33Ag-4.83Bi/Cu couples resulted in the growth of an intermetallic compound layer at the solder/substrate interface comprised of Cu3Sn and the Cu6Sn5 sublayers.