scispace - formally typeset
P

Paul W. Ackmann

Researcher at Advanced Micro Devices

Publications -  15
Citations -  204

Paul W. Ackmann is an academic researcher from Advanced Micro Devices. The author has contributed to research in topics: Reticle & Stepper. The author has an hindex of 6, co-authored 15 publications receiving 204 citations.

Papers
More filters
Proceedings ArticleDOI

Phase shifting and optical proximity corrections to improve CD control on logic devices in manufacturing for sub-0.35-μm i-line

TL;DR: In this paper, differential modification techniques were used to reduce the effects of topography, density, and low k lens issues in I-Line exposure wavelength for manufacturing at and beyond 0.35 micrometers.
Patent

Method and apparatus for programmed latency for improving wafer-to-wafer uniformity

TL;DR: In this article, the authors present a method and an apparatus for implementing programmed latency for improved wafer-to-wafer uniformity using a trajectory of recipes for the identified semiconductor devices.
Patent

Automated data management system for analysis and control of photolithography stepper performance

TL;DR: An automated data management system for enabling the analysis and control of the performance of photolithography steppers in a submicron fabrication facility was described in this article, where a windows-based user interface was presented for selecting and initiating analysis procedures by selecting from a variety of options displayed on the user's PC.
Patent

Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate

TL;DR: In this paper, an alignment mark is formed within a window area of the semiconductor substrate, where the upper surface of the substrate within the window area is recessed below the original surface.
Patent

Mark protection with transparent film

TL;DR: In this article, an alignment mark protection structure (95 ) is disclosed which is used to ensure an integrity of an alignment scheme for a substrate ( 50 ) which is to be subjected to lithographic processing.