P
Pawitter J. S. Mangat
Researcher at Motorola
Publications - 71
Citations - 986
Pawitter J. S. Mangat is an academic researcher from Motorola. The author has contributed to research in topics: Extreme ultraviolet lithography & Lithography. The author has an hindex of 18, co-authored 71 publications receiving 974 citations. Previous affiliations of Pawitter J. S. Mangat include University of California & Freescale Semiconductor.
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Patent
Method and apparatus for manipulating a displayed image
TL;DR: In this paper, a method for manipulating an image displayed on an electronic device is described, which includes panning the image in response to a detection of a first stroke (125, 410, 610 ) of a touch-and pressure-sensitive input modality, while the electronic device was in a pan mode; changing between pan mode and a zoom mode, when the stroke was performed using an amount of touch pressure that meets a first pressure criterion; and then zooming the image to a second stroke (130, 415, 615) while the device is in the zoom mode
Patent
Reflective mask useful for transferring a pattern using extreme ultra violet (EUV) radiation and method of making the same
TL;DR: In this paper, an EUV mask (10, 309 ) includes an opening (26) that helps to attenuate and phase shift extreme ultraviolet radiation using a subtractive rather than additive method.
Journal ArticleDOI
Review of progress in extreme ultraviolet lithography masks
TL;DR: In this article, the authors developed mask blank multilayer coating processes with low added defect density, such as defect compensation and buffer layer smoothing, to reduce the added defect printability.
Patent
Coatings on reflective mask substrates
William Man-Wai Tong,John S. Taylor,Scott Daniel Hector,Pawitter J. S. Mangat,Alan R. Stivers,Patrick G. Kofron,Matthew A. Thompson +6 more
TL;DR: In this article, a process for creating a mask substrate involving depositing: 1) a coating on one or both sides of a low thermal expansion material EUVL mask substrate to improve defect inspection, surface finishing, and defect levels; and 2) a high dielectric coating on the backside to facilitate electrostatic chucking and to correct for any bowing caused by either other deposited coating or the multilayer coating of the mask substrate.
Journal ArticleDOI
Demonstration of pattern transfer into sub-100 nm polysilicon line/space features patterned with extreme ultraviolet lithography
Gregory Frank Cardinale,Craig C. Henderson,John E. M. Goldsmith,Pawitter J. S. Mangat,Jonathan L. Cobb,Scott Daniel Hector +5 more
TL;DR: In this paper, the authors demonstrated the transfer of dense and loose-pitch line/space (L/S) photoresist features, patterned with extreme ultraviolet (EUV) lithography, into an underlying hard mask material.