P
Pei-Haw Tsao
Researcher at TSMC
Publications - 6
Citations - 251
Pei-Haw Tsao is an academic researcher from TSMC. The author has contributed to research in topics: Heat spreader & Thermal copper pillar bump. The author has an hindex of 5, co-authored 6 publications receiving 251 citations.
Papers
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Patent
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
Chao-Yuan Su,Pei-Haw Tsao,Hsin-Hui Lee,Chender Huang,Shang Y. Hou,Jeng Shin Pau,Tsai Hao Yi,Chenming Hu +7 more
TL;DR: In this paper, the first and second scribe lines intersect to define one corner point of a die and free area A1 is defined on the first scribe line and is defined by the equation A1=D1×S1.
Patent
Underbump Metallization Structure
Yu-Wen Liu,Hao-Yi Tsai,Hsien-Wei Chen,Shin-puu Jeng,Ying-Ju Chen,Shang-Yun Hou,Pei-Haw Tsao,Chen-Hua Yu +7 more
TL;DR: In this paper, a system and method for forming an underbump metallization (UBM) contact is presented, which extends through a passivation layer so as to make contact with a contact pad while retaining enough of the passivation between the contact pad and the UBM to handle the peeling and shear stress that results from CTE mismatch and subsequent thermal processing.
Patent
Three dimensional package and packaging method for integrated circuits
TL;DR: In this paper, a land grid array (LGA) or quad flat no-lead (QFN) is mounted on a 3D package substrate, and a second die is mounted directly on a second side of the LGA or QFN substrate opposite the first side.
Patent
Heat spreader and package structure utilizing the same
TL;DR: In this article, a heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the mold.
Patent
Fine pitch bonding pad layout and method of manufacturing same
TL;DR: In this article, a bonding pad formed on an IC chip for electrically coupling the IC chip to another device or component, and associated methods of manufacturing the bonding pad are discussed.