A shielded medical device implanted in a biological organism. The device has a magnetic shield, and the magnetic shield contains a layer of nanomagnetic material; such layer has a morphological density of at least 98 percent; and it is bonded to the medical device by means of an interlayer with a thickness of less than about 10 microns. The nanomagnetic material in such layer has a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5,000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 100 nanometers.

Magnetically shielded assembly

An organic light-emitting diode (OLED) display is disclosed. In one aspect, the display includes a stretchable substrate, a thin film transistor (TFT) formed over the stretchable substrate and including a plurality of electrodes, an OLED electrically connected to the TFT and including a plurality of electrodes, and a plurality of interconnection lines connected to the electrodes of the OLED and the TFT. At least one of the interconnection lines is configured to move in a stretching direction and rotate an electrode selected from the electrodes of the OLED and the TFT connected to the at least one interconnection line.

Organic light-emitting diode display

This invention relates to polyolefin compositions. In particular, the invention pertains to elastic polymer compositions that can be more easily processed on cast film lines, extrusion lamination or coating lines. The compositions of the present invention preferably comprise an elastomeric polyolefin resin and a high pressure low density type resin.

Compositions of ethylene/alpha-olefin multi-block interpolymer for elastic films and laminates

A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region The semiconductive layer is provided in the second region

Wired circuit board

An example magnetic recording head includes: a main magnetic pole; a laminated body; and a pair of electrodes. The laminated body includes a first magnetic layer having a coercivity lower than magnetic field applied by the main magnetic pole, a second magnetic layer having a coercivity lower than the magnetic field applied by the main magnetic pole, and an intermediate layer provided between the first magnetic layer and the second magnetic layer. The pair of electrodes is operable to pass a current through the laminated body.

Magnetic recording head and magnetic recording apparatus

The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device having a flat bottom contacts the chips, while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components. The present high conduction cooling module allows for the simple incorporation of side biasing means and a grooved chip interface on the finned internal thermal devices to provide enhanced thermal performance if required.

High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology

A bidirectional linear thin film tape head and drive are disclosed with a flat contour on a wear resistant ceramic substrate. At least one thin film transducer is provided on a side of the substrate, forming one edge to the flat transducing surface, and another edge is formed at the opposite side of the flat transducing surface. In one embodiment, both the transducer edge, with an alumina overcoat protecting the transducer, and the opposite edge of the flat transducing surface form outer tape path edges, and in another embodiment, the thin film transducer is protected by a ceramic closure that covers the thin film transducer and forms an extension to the flat transducing surface which provides an outer tape path edge. The edges remove the air entrained by the tape moving relative to the head in either direction to allow contact or near contact recording with the flat transducing surface.

Bidirectional flat contour linear tape recording head and drive

A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.

Lapping process for minimizing shorts and element recession at magnetic head air bearing surface

A filled-gap magnetic recording head is provided comprising a flat or cylindrical contour head having a row of magnetic transducers in a gap region disposed between a rowbar substrate and a closure. The gap region is intentionally recessed to have a predetermined recess profile below a tape support surface. An electrical insulation layer is deposited on the tape support surface and on the recess profile of the gap region. The insulation layer prevents electrical shorting between the magnetic transducers and other conductive elements in the gap due to accumulations of conductive debris from the magnetic recording tape. A method of making the filled-gap magnetic recording head by intentionally recessing the gap region, cleaning the recessed profile and depositing an insulator layer is provided.

Filled-gap magnetic recording head and method of making

Disclosed is a dimple magnetic recording head in a transducer assembly for linear tape drives. The dimple head has a flat transducing surface extending laterally a partial width of the magnetic recording tape. Two parallel tape support surfaces extend laterally the full width of the magnetic recording tape, positioned on either side of and spaced from the dimple head in the longitudinal direction of the magnetic recording tape. The tape support surfaces form a plane, and the dimple head flat transducing surface is parallel to the tape support surface plane and projects above the tape support surface plane to form tape wrap angles with respect to the tape support surfaces within a range of approximately 1/2 degree to 2.5 degrees. The dimple magnetic tape head is mass produced by lapping a row of transducers on a substrate to form a flat transducing surface. The row of substrate elements is then diced into separate substrate elements. The two parallel, spaced apart tape support surfaces are provided, and one of the diced substrate elements is mounted intermediate the tape support surfaces with the flat transducing surface exposed for forming a tape facing surface.

Robert G. Biskeborn

Papers

High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology

Bidirectional flat contour linear tape recording head and drive

Lapping process for minimizing shorts and element recession at magnetic head air bearing surface

Filled-gap magnetic recording head and method of making

Partial width mass produced linear tape recording head