R
Romain Cauchois
Researcher at Gemalto
Publications - 16
Citations - 138
Romain Cauchois is an academic researcher from Gemalto. The author has contributed to research in topics: Printed electronics & Thin film. The author has an hindex of 6, co-authored 16 publications receiving 123 citations. Previous affiliations of Romain Cauchois include Ecole nationale supérieure des mines de Saint-Étienne & École Normale Supérieure.
Papers
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Journal ArticleDOI
Industrial-scale inkjet printed electronics manufacturing—production up-scaling from concept tools to a roll-to-roll pilot line
Robert Abbel,P. Teunissen,Eric Rubingh,Tim van Lammeren,Romain Cauchois,Marcel Everaars,Joost Valeton,Sjoerd van de Geijn,Pim Groen +8 more
TL;DR: In this paper, an efficient strategy for the up-scaling of processing technology for inkjet printing of silver nanoparticle inks towards industrially relevant manufacturing volumes is described by the roll-to-roll production of fine conductive patterns on polymer foils.
Proceedings ArticleDOI
Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages
Romain Cauchois,Mohamed Saadaoui,Jacques Legeleux,Thierry Malia,Béatrice Dubois-Bonvalot,Karim Inal,Jean-Christophe Fidalgo +6 more
TL;DR: In this paper, a 1.7 µm thick nickel layer is deposited on top of 600 nm thick printed and sintered silver nanoparticles using Kapton polyimide as substrate.
Journal ArticleDOI
Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles
Romain Cauchois,Romain Cauchois,Mohamed Saadaoui,Abdelwahhab Yakoub,Karim Inal,Béatrice Dubois-Bonvalot,Jean-Christophe Fidalgo +6 more
TL;DR: In this paper, the effect of thermal profile on microstructure was studied in the frame of thin films deposited by inkjet-printing technology, and the role of sintering temperature and thermal ramp was particularly investigated.
Journal ArticleDOI
Photonic flash soldering of thin chips and SMD components on foils for flexible electronics
Daan van den Ende,Rob Hendriks,Romain Cauchois,Roel Kusters,Maarten Cauwe,Wilhelm A. Groen,Jeroen van den Brand +6 more
TL;DR: In this paper, a high-power xenon light flash was used to successfully solder ultrathin bare die chips and small-size surface mount device components to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using a lead-free solder paste.
Journal ArticleDOI
Large Area Photonic Flash Soldering of Thin Chips on Flex Foils for Flexible Electronic Systems: In Situ Temperature Measurements and Thermal Modelling
TL;DR: In this article, photonic energy from a high power xenon flash lamp is used for soldering thin chips on polyimide and polyester foil substrates using standard Sn-Ag-Cu lead free alloys.