R
Rong Ren
Researcher at Shenyang Aerospace University
Publications - 37
Citations - 363
Rong Ren is an academic researcher from Shenyang Aerospace University. The author has contributed to research in topics: Epoxy & Polyetherimide. The author has an hindex of 10, co-authored 31 publications receiving 252 citations.
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Journal ArticleDOI
Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine
TL;DR: In this article, the optimal formulation of DGEBA/BAPP system was obtained in terms of the curing behavior and glass transition temperature determined by dynamic differential scanning calorimetery (DSC).
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The curing kinetics and thermal properties of epoxy resins cured by aromatic diamine with hetero-cyclic side chain structure
TL;DR: In this paper, the use of novel aromatic diamine containing phthalide structure (BAPP) as curing agent of diglycidylether of bisphenol A (DGEBA) epoxy resin has been studied.
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Thermal, mechanical properties and shape memory performance of a novel phthalide-containing epoxy resins
TL;DR: In this article, a phthalide-containing aromatic amine (PBMI-DDE) was synthesized by adding 3,3-bis[4-(4-maleimidophenoxy)phenyl]phthalide and 4,4′-diaminodiphenylether (DDE), its chemical structure was confirmed by NMR and Fourier transform infrared (FTIR) spectrometer.
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Preparation and properties of modified bismaleimide resins based on phthalide‐containing monomer
TL;DR: A series of bismaleimide resins based on phthalide-containing monomer have been prepared by the copolymerization reaction of 3,3-bis[4-(4-maleimidophenoxy)phenyl] -phthalide (PPBMI), 4, 4'-dimaleimido diphenylmethane (MBMI) and 2, 2'-diallyl bisphenol A (DABPA) in different feed ratios as discussed by the authors.
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The thermal decomposition behavior and kinetics of epoxy resins cured with a novel phthalide-containing aromatic diamine
TL;DR: In this article, the thermal decomposition behaviors and kinetics of diglycidyl ether of bisphenol A (DGEBA) epoxy resin cured by a novel phthalide-containing aromatic diamine (BAPP), were studied by thermal gravimetric analysis (TGA) technique in comparison with these of epoxy systems cured by 4,4′-diaminodiphenylsulfone (DDS) and equimolar mixture of DDS/BAPP, respectively.