Power semiconductor devices are key components in power conversion systems. Silicon carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable for high-voltage and low-loss power devices. Through recent progress in the crystal growth and process technology of SiC, the production of medium-voltage (600?1700 V) SiC Schottky barrier diodes (SBDs) and power metal?oxide?semiconductor field-effect transistors (MOSFETs) has started. However, basic understanding of the material properties, defect electronics, and the reliability of SiC devices is still poor. In this review paper, the features and present status of SiC power devices are briefly described. Then, several important aspects of the material science and device physics of SiC, such as impurity doping, extended and point defects, and the impact of such defects on device performance and reliability, are reviewed. Fundamental issues regarding SiC SBDs and power MOSFETs are also discussed.

https://iopscience.iop.org/article/10.7567/JJAP.54.040103/pdf

Material science and device physics in SiC technology for high-voltage power devices

The wet etching of GaN, AlN, and SiC is reviewed including conventional etching in aqueous solutions, electrochemical etching in electrolytes and defect-selective chemical etching in molten salts. The mechanism of each etching process is discussed. Etching parameters leading to highly anisotropic etching, dopant-type/bandgap selective etching, defect-selective etching, as well as isotropic etching are discussed. The etch pit shapes and their origins are discussed. The applications of wet etching techniques to characterize crystal polarity and defect density/distribution are reviewed. Additional applications of wet etching for device fabrication, such as producing crystallographic etch profiles, are also reviewed.

Wet etching of GaN, AlN, and SiC : a review

Only a few years ago, an account of degradation of silicon carbide high-voltage p-i-n diodes was presented at the European Conference on Silicon Carbide and Related Compounds (Kloster Banz, Germany, 2000). This report was followed by the intense effort of multiple groups utilizing varied approaches and subsequent progress in both fundamental understanding of this phenomenon and its elimination. The degradation of SiC p-i-n junctions is now well documented to be due to the expansion of Shockley-type stacking faults in the part of the devices reached by the electron-hole plasma. The faults can gradually cover most of the junction area, impeding current flow and, as a result, increasing the on-state resistance. While in most semiconductors stacking faults are electrically inactive, in hexagonal silicon carbide polytypes (4H- and 6H-SiC) they form quantum-well-like electron states observed in luminescence and confirmed by first-principles calculations. The stacking-fault expansion occurs via motion of 30° sil...

Degradation of hexagonal silicon-carbide-based bipolar devices

Wide-bandgap semiconductors are expected to be applied to solid-state lighting and power devices, supporting a future energy-saving society. While GaN-based white LEDs have rapidly become widespread in the lighting industry, SiC- and GaN-based power devices have not yet achieved their popular use, like GaN-based white LEDs for lighting, despite having reached the practical phase. What are the issues to be addressed for such power devices? In addition, other wide-bandgap semiconductors such as diamond and oxides are attracting focusing interest due to their promising functions especially for power-device applications. There, however, should be many unknown phenomena and problems in their defect, surface, and interface properties, which must be addressed to fully exploit their functions. In this review, issues of wide-bandgap semiconductors to be addressed in their basic properties are examined toward their ?full bloom?.

/pdf/wide-bandgap-semiconductor-materials-for-their-full-bloom-7wjoaf5zpd.pdf

Wide-bandgap semiconductor materials: For their full bloom†

Dislocation conversion in 4H silicon carbide epitaxy

Integrated process modeling and experimental validation of silicon carbide sublimation growth

Dislocation nucleation in 4H silicon carbide epitaxy

http://mimp.materials.cmu.edu/rohrer/papers/2000_01.pdf

Origin of domain structure in hexagonal silicon carbide boules grown by the physical vapor transport method

Optical microscopy, synchrotron white beam x-ray topography (SWBXT), and high resolution x-ray diffraction (HRXRD) were used to study the distribution of basal plane dislocations in bulk 4H silicon carbide crystals grown by the physical vapor transport method. An etch pit array was observed on the silicon face of KOH-etched off-cut wafers. The arrays were aligned parallel to each other and perpendicular to the off-cut direction. The etch pits were oval-shaped, which is characteristic of basal plane dislocations. Corresponding array images have been observed by SWBXT. Based on the characteristic distribution, the etch pit arrays are interpreted as the slip traces of high temperature deformation during the growth process. Thermoelastic stress is proposed as the plausible cause of the deformation. In addition, basal plane dislocation pileups were found in the proximity of polygonized threading edge dislocation arrays. SWBXT and HRXRD were used to study the misorientation related to such dislocation structure...

S. Ha

Papers

Dislocation conversion in 4H silicon carbide epitaxy

Integrated process modeling and experimental validation of silicon carbide sublimation growth

Dislocation nucleation in 4H silicon carbide epitaxy

Origin of domain structure in hexagonal silicon carbide boules grown by the physical vapor transport method

Basal plane slip and formation of mixed-tilt boundaries in sublimation-grown hexagonal polytype silicon carbide single crystals