The unique characteristics of ultrafast lasers, such as picosecond and femtosecond lasers, have opened up new avenues in materials processing that employ ultrashort pulse widths and extremely high peak intensities. Thus, ultrafast lasers are currently used widely for both fundamental research and practical applications. This review describes the characteristics of ultrafast laser processing and the recent advancements and applications of both surface and volume processing. Surface processing includes micromachining, micro- and nanostructuring, and nanoablation, while volume processing includes two-photon polymerization and three-dimensional (3D) processing within transparent materials. Commercial and industrial applications of ultrafast laser processing are also introduced, and a summary of the technology with future outlooks are also given. Scientists in Asia have reviewed the role of ultrafast lasers in materials processing. Koji Sugioka from RIKEN in Japan and Ya Cheng from the Shanghai Institute of Optics and Fine Mechanics in China describe how femtosecond and picosecond lasers can be used to perform useful tasks in both surface and volume processing. Such lasers can cut, drill and ablate a variety of materials with high precision, including metals, semiconductors, ceramics and glasses. They can also polymerize organic materials that contain a suitable photosensitizer and can three-dimensionally process inside transparent materials such as glass, and are already being used to fabricate medical stents, repair photomasks, drill ink-jet nozzles and pattern solar cells. The researchers also explain the characteristics of such lasers and the interaction of ultrashort, intense pulses of light with matter.

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Ultrafast lasers—reliable tools for advanced materials processing

In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired. The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the X, Y and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.

Method for controlling configuration of laser induced breakdown and ablation

Laser ablation of dielectrics by ultrashort laser pulses is reviewed. The basic interaction between ultrashort light pulses and the dielectric material is described, and different approaches to the modeling of the femtosecond ablation dynamics are reviewed. Material excitation by ultrashort laser pulses is induced by a combination of strong-field excitation (multi-photon and tunnel excitation), collisional excitation (potentially leading to an avalanche process), and absorption in the plasma consisting of the electrons excited to the conduction band. It is discussed how these excitation processes can be described by various rate-equation models in combination with different descriptions of the excited electrons. The optical properties of the highly excited dielectric undergo a rapid change during the laser pulse, which must be included in a detailed modeling of the excitations. The material ejected from the dielectric following the femtosecond-laser excitation can potentially be used for thin-film deposition. The deposition rate is typically much smaller than that for nanosecond lasers, but film production by femtosecond lasers does possess several attractive features. First, the strong-field excitation makes it possible to produce films of materials that are transparent to the laser light. Second, the highly localized excitation reduces the emission of larger material particulates. Third, lasers with ultrashort pulses are shown to be particularly useful tools for the production of nanocluster films. The important question of the film stoichiometry relative to that of the target will be thoroughly discussed in relation to the films reported in the literature.

https://iopscience.iop.org/article/10.1088/0034-4885/76/3/036502/pdf

Femtosecond-laser ablation dynamics of dielectrics: basics and applications for thin films

In 1982, the first reports of laser ablation of polymers were issued almost simultaneously by Y. Kawamura et al.1 and R. Srinivasan et al.2 Srinivasan went on to become a leader in the field of polymer ablation. Srinivasan probably also coined the terms laser ablation and ablative photodecomposition, now in common use. The onset of material removal by laser ablation characteristically occurs at a well-defined laser fluence (energy per unit area). As the fluence is raised above this threshold, the ablation rate increases. The threshold fluence (F0 or Fth) is material and laser wavelength dependent and can vary from tens of mJ cm-2 to more than 1 J cm-2. The discovery of laser ablation of polymers sparked research in this field in many groups around the world. Many aspects of polymer ablation, and laser processing in general, are reviewed by Bauerle.3 Today, commercial applications of polymer laser ablation include the preparation of viaholes in polyimide for multichip modules at IBM4 and the production of inkjet printer nozzles (also polyimide).5 Considerable progress has been made in understanding polymer ablation since the last series of reviews a decade ago.6-8 New developments in polymer ablation include the application of femtosecond laser pulses, vacuum ultraviolet lasers (VUV), and free electron lasers (FEL). Some of these techniques have a great potential for the development of new applications and research tools. Much of this progress is discussed in this and other articles appearing in this special issue of Chemical Reviews. Current research on polymer ablation may be divided into two areas: (i) Applications of laser ablation, novel materials, and techniques. (ii) Studies of ablation mechanisms (databased modeling). The first area will be discussed in detail in this article, while the mechanistic aspects, especially the theoretical part, are discussed in other articles in this special issue. Many experimental methods and experimental polymers have been designed with a view toward improving our understanding of ablation mechanisms. It is often impossible to completely separate experiments designed to illuminate ablation mech† Paul Scherrer Institut. ‡ Washington State University. 453 Chem. Rev. 2003, 103, 453−485

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Chemical and spectroscopic aspects of polymer ablation: Special features and novel directions

A method of laser processing or laser modification of materials. The combination of ultrafast laser pulses and high-repetition rate (>100 kHz) bursts (or continuous operation) defines a new and unexpected regime for material processing. The high repetition rate controls thermal and/or other relaxation processes evolving between each ultrafast laser pulse that ‘prepares’ the sample surface or bulk to alter the interaction with subsequent ultrafast laser pulses and thereby improve or optimize the process, or enable a new process, that are not available at lower repetition rate. The addition of this laser-controlled thermal component, and/or the general control of relaxation processes, overcomes several current limitations of ultrafast laser processing at lower repetition rates (<100 kHz), providing means to further harness the many attributes of ultrafast lasers for general material processing and material modification applications.

Burst-ultrafast laser machining method

Experiments on the ablation of polymethylmethacrylate (PMMA) with 300 fs uv excimer laser pulses at 248 nm are reported for the first time. With these ultrashort pulses, ablation can be done at fluences up to five times lower than the threshold fluence for 16 ns ablation of PMMA, and the surface morphology is improved, also for several other materials. A model for ablation is proposed, assuming a non-constant absorption coefficient αeff depending on the degree of incubation of the irradiated material and the intensity of the incoming excimer laser pulse. The agreement between our model and our experimental observations is excellent for 16 ns excimer laser pulses, also predicting perfectly the shape of a pulse transmitted through a thin PMMA sample under high fluence irradiation. Qualitative agreement for 300 fs excimer laser pulses is obtained so far.

S. Kuper

Papers

Femtosecond UV excimer laser ablation