S
Sean T. Crowley
Researcher at Amkor Technology
Publications - 15
Citations - 778
Sean T. Crowley is an academic researcher from Amkor Technology. The author has contributed to research in topics: Semiconductor package & Die (integrated circuit). The author has an hindex of 14, co-authored 15 publications receiving 778 citations.
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Patent
Stackable semiconductor package and method for manufacturing same
TL;DR: The Micro Lead Frame (MLF) as discussed by the authors allows the semiconductor packages to be stacked on top of each other, and the protruding parts of the leads form a space between the stacked semiconductor package for improved heat dissipation.
Patent
Electronic device package and leadframe and method for making the package
TL;DR: In this article, an integrated circuit device on a metal die pad is presented, which is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive tape that connects the ring to the diepad.
Patent
Thin leadframe-type semiconductor package having heat sink with recess and exposed surface
TL;DR: In this article, a small-outline semiconductor package, and a thermally enhanced leadframe for use in it, comprise a plurality of electrically conductive leads held together in a spaced, planar relationship about a central opening defined by the leads, and the heat sink made of an electrically and thermally conductive metal attached to the leads such that it is centered within the opening and parallel to the plane of the leads.
Patent
Low profile package for plural semiconductor dies
TL;DR: In this article, a package for one or more semiconductor die is disclosed, along with a method of making the package, and the package includes a substrate having opposed top and bottom surfaces and an aperture therebetween.
Patent
Method of molding plastic semiconductor packages
TL;DR: In this article, the plating of all of the surfaces of the molding tool that comes into contact with the molten resin during molding with a nodular thin dense chromium (NTDC) coating prevents the surfaces from adhering to the package body and ensures good package release, without formation of cracks or craters in package body.