S
Seongjun Kim
Researcher at Osaka University
Publications - 14
Citations - 746
Seongjun Kim is an academic researcher from Osaka University. The author has contributed to research in topics: Soldering & Microstructure. The author has an hindex of 8, co-authored 14 publications receiving 699 citations.
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Journal ArticleDOI
High-Temperature Lead-Free Solders: Properties and Possibilities
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Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders
TL;DR: In this article, the die attach properties of Zn-xSn solders on an aluminum nitride-direct bonded copper substrate were investigated and the shear strength of the Cu/solder/Cu joint with ZnSn solder was about 30MPa to 34MPa, which was higher than that of Pb-5Sn solder (26MPa).
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Alloy design of Zn-Al-Cu solder for ultra high temperatures
TL;DR: In this article, a Zn-based solders were developed for ultra high temperature applications with the alloying elements: (4-6) ¼ Al and (1-5 ¼ Cu).
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Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier
TL;DR: In this article, a sound die attachment on an aluminum nitride (AlN) direct-bonded copper (DBC) substrate was achieved by forming Cu-Zn intermetallic compound (IMC) layers at the interface with the Cu of the substrate.
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Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
TL;DR: In this article, the authors investigated the melting range, microstructure, mechanical properties and spreadabililty of Zn-(4� 6 mass%)Al − Cu alloys and found that increasing the Al and Cu contents, hardness and tensile strength increased, but elongation decreased.