K
Keun-Soo Kim
Researcher at Hoseo University
Publications - 91
Citations - 3625
Keun-Soo Kim is an academic researcher from Hoseo University. The author has contributed to research in topics: Soldering & Microstructure. The author has an hindex of 28, co-authored 91 publications receiving 3362 citations. Previous affiliations of Keun-Soo Kim include Osaka University.
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Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
TL;DR: In this paper, the effects of alloy composition on microstructural, especially the formation of large intermetallic compounds, and mechanical properties of various Sn-Ag-Cu solder joints were investigated.
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High-Temperature Lead-Free Solders: Properties and Possibilities
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Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
TL;DR: The effects of the fourth elements, i.e., Fe, Ni, Co, Mn and Ti, on microstructural features, undercooling characteristics, and monotonic tensile properties of Sn–3 wt.%Ag–0.%Cu lead-free solder were investigated and Ni alloy is more reliable solder alloy with improved properties for all tests in the present work.
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Low-temperature low-pressure die attach with hybrid silver particle paste
TL;DR: New types of die attach pastes comprising micron-sized Ag particles hybridized with submicron- sized Ag particles were considered as lead-free die attach materials for SiC power semiconductors, and the Ag die attach bond layer was stable against thermal cycles between −40 °C and 300 ° C.
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Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys
TL;DR: In this article, the effects of the addition of Bi to Sn-Zn near eutectic alloy and cooling rate on the thermal and mechanical properties were investigated, and it was also confirmed that the difference of cooling rates significantly affects the microstructure and properties.