Shinji Nakagawa

TL;DR: In this paper, the authors used thermal transient test and thermal structure function based approach to analyze thermal characteristic and heat flux in a real IGBT package, which is proven to be valid for thermal structural analysis, however in most of practical cases material properties like thermal conductivity or contact thermal resistance are always unknown.

TL;DR: In this article, the authors focus on power Si MOSFET, and discuss thermal properties using electro-thermal analysis, and the calculation results show that a hot spot appears in power Si mosFET and the hot spot temperature is higher with increase in applied voltage and the appearance position of the hot spots is almost the same in any analysis condition when applied voltage is changed.

TL;DR: In this article, the effect of increased inclination and porosity coefficient of outlet openings on the cooling capability of a thin laptop PC was investigated, and the experimental data were reduced to a Nusselt number-Rayleigh number correlation, by using a modified reference length.

TL;DR: In this article, the authors applied thermal network analysis to the thermal design of the chip and found that higher thermal conductivity material of the inter-chip-fill (the underfill resin between wafers) or more than 10 % of the Interconnection area is required for the temperature management.

TL;DR: In this article, the authors measured the performance of axial air-cooling fans in an enclosure and explored the effects of the inlet size and shape while varying the speed of revolution of the fan.