scispace - formally typeset
Journal ArticleDOI

Study on the chimney effect in natural air‐cooled electronic equipment casings under inclination: Proposal of a thermal design correlation that includes the porosity coefficient of an outlet opening

TLDR
In this article, the effect of increased inclination and porosity coefficient of outlet openings on the cooling capability of a thin laptop PC was investigated, and the experimental data were reduced to a Nusselt number-Rayleigh number correlation, by using a modified reference length.
Abstract
Natural air-cooling technologies for electronic equipment have the important advantages of no fan and high reliability. However, natural air cooling has lower cooling capability than fan air cooling, so enhancement of its cooling capability is required. This paper presents the results for experimental casings designed to employ the chimney effect in natural air-cooled electronic equipment. The system casing is inclined to enhance the effectiveness of natural air cooling. Experiments were carried out using a thin laptop PC. We investigated the effect on cooling capability produced by inclining the casing and by varying the outlet positions and numbers and the porosity coefficient of the outlet openings. The results show that the temperatures inside the casing and heater surfaces are slightly diminished by the effect of increased inclination and porosity coefficient of outlet openings. Moreover, the increase in natural circulation flux in the casing was quantitatively proven by experiments. In addition, the experimental data were reduced to a Nusselt number–Rayleigh number correlation, , by using a modified reference length. © 2006 Wiley Periodicals, Inc. Heat Trans Asian Res, 35(2): 122–136, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20103

read more

Citations
More filters
Journal ArticleDOI

Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites

TL;DR: A flexible composite material based on nano-efficient cooling methods that can keep the layout and through the improvement of internal thermal path, it can achieve the effective heat dissipation of electronic equipment.

The Detrimental Effects of Water on Electronic Devices

TL;DR: The forms of water and the degradation effect of water on electronics are discussed, the types of failure mechanisms in electronics induced by liquid and vapor phase water are identified, and recommendations for preventing water-imposed degradation in electronics are provided.
Journal ArticleDOI

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

TL;DR: In this paper, the effects of parameters such as vertical alignment of the slots, horizontal alignment of slots, area of slots and differential slot opening on natural convection cooling were studied.
Journal ArticleDOI

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

TL;DR: In this paper, the authors carried out thermal design and evaluated the cooling performance of power electronic devices (PEDs) containing electronic equipment, and the experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme.
Journal ArticleDOI

Natural convective characteristics of a heat source module at different angles in the closed and ventilated cabinets

TL;DR: In this paper, a numerical analysis is performed to study the characteristics of heat transfer from a block heat source module at different angles in two-dimensional cabinets, and the effect of thermal interaction between the air steams inside and outside the cabinet on the conjugate conduction-natural convection phenomena is rigorously examined.
References
More filters
Journal ArticleDOI

On the Cooling of Natural-air-cooled Electronic Equipment Casings : Proposal of a Practical Formula for Thermal Design

TL;DR: In this article, a simple formula for thermal designing of natural-air-cooled electronic equipment casings with standard arrangement of circuit boards and power supplies was presented, since it represents an air cooling system in its simplified form with due regard to such factors as the stack effect, air flow resistance, natural convective transfer and so on.
Journal ArticleDOI

Studies on natural convection-induced flow and thermal behaviour inside electronic equipment cabinet model

TL;DR: In this paper, an important basic flow phenomenon, natural convection-induced flow, is studied numerically and the results of calculation showed a satisfactory agreement with the measured data and led to a good understanding of the overall flow and thermal behaviour inside an electronic equipment cabinet model.
Journal ArticleDOI

On the cooling of natural-air-cooled electronic equipment casings (Proposal of a practical formula for thermal design)

TL;DR: In this article, a simple formula for thermal designing of natural-air-cooled electronic equipment casings with standard arrangement for circuit boards and power supplies is presented, which is applied to predict temperature rise for two practically used electronic equipment cabinets with standard arrangements and a modeling case.
Related Papers (5)