scispace - formally typeset
S

Siddharth Garg

Researcher at New York University

Publications -  196
Citations -  5768

Siddharth Garg is an academic researcher from New York University. The author has contributed to research in topics: Computer science & Matching (graph theory). The author has an hindex of 30, co-authored 167 publications receiving 3735 citations. Previous affiliations of Siddharth Garg include Wilmington University & Thales Group.

Papers
More filters
Posted Content

BadNets: Identifying Vulnerabilities in the Machine Learning Model Supply Chain.

TL;DR: It is shown that outsourced training introduces new security risks: an adversary can create a maliciously trained network (a backdoored neural network, or a BadNet) that has state-of-the-art performance on the user's training and validation samples, but behaves badly on specific attacker-chosen inputs.
Journal ArticleDOI

BadNets: Evaluating Backdooring Attacks on Deep Neural Networks

TL;DR: It is shown that the outsourced training introduces new security risks: an adversary can create a maliciously trained network (a backdoored neural network, or a BadNet) that has the state-of-the-art performance on the user's training and validation samples but behaves badly on specific attacker-chosen inputs.
Posted Content

Fine-Pruning: Defending Against Backdooring Attacks on Deep Neural Networks

TL;DR: Fine-pruning is evaluated, a combination of pruning and fine-tuning, and it is shown that it successfully weakens or even eliminates the backdoors, i.e., in some cases reducing the attack success rate to 0% with only a \(0.4\%\) drop in accuracy for clean (non-triggering) inputs.
Book ChapterDOI

Fine-Pruning: Defending Against Backdooring Attacks on Deep Neural Networks

TL;DR: In this article, a combination of pruning and fine-tuning is proposed to defend against backdoor attacks in deep neural networks, and it successfully weakens or even eliminates the backdoors.
Proceedings ArticleDOI

The EDA Challenges in the Dark Silicon Era: Temperature, Reliability, and Variability Perspectives

TL;DR: New challenges as well as opportunities are described in the context of the interaction of dark silicon with thermal, reliability and variability concerns, and preliminary experimental evidence in their support is provided.