S
Simon W. Tam
Researcher at Applied Materials
Publications - 8
Citations - 309
Simon W. Tam is an academic researcher from Applied Materials. The author has contributed to research in topics: Wafer & Etching (microfabrication). The author has an hindex of 7, co-authored 8 publications receiving 309 citations.
Papers
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Patent
Method for plasma etching a chromium layer suitable for photomask fabrication
Xiaoyi Chen,Michael N. Grimbergen,Madhavi R. Chandrachood,Jeffrey X. Tran,Ashok Kumar,Simon W. Tam,Ramesh Krishnamurthy +6 more
TL;DR: In this paper, a method for etching a chromium layer is described, which is particularly suitable for fabricating photomasks and can be used for plasma etching of chromium layers.
Patent
Compound clamp ring for semiconductor wafers
Semyon Sherstinsky,Mei Chang,Charles C. Harris,Alan F. Morrison,Virendra V. S. Rana,James F. Roberts,Ashok Sinha,Simon W. Tam +7 more
TL;DR: In this paper, a compound clamp ring is used to secure a semiconductor wafer having a flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the pedestal to prevent leakage of coolant gases.
Patent
Electrostatic chuck with fluid flow regulator
Semyon Sherstinsky,John F. Cameron,Shamouil Shamouilian,Manoocher Birang,Alfred Mak,Simon W. Tam,Robert E. Ryan +6 more
TL;DR: In this paper, an electrostatic chuck 20 is proposed to maintain substantially uniform temperatures across a substrate 30 by electrostatically holding the substrate 30 on the conformal contact surface 50 to define an outer periphery with leaking portions and sealed portions.
Patent
In-situ photoresist capping process for plasma etching
TL;DR: In this article, a two-step photoresist capping process for enhancing the etch resistance of photoresists during chlorinated plasma etching of silicon-containing materials was proposed.
Patent
Clamping ring apparatus for processing semiconductor wafers
Semyon Sherstinsky,Mei Chang,Charles C. Harris,Alfred Mak,James F. Roberts,Simon W. Tam,Wen T. Chang +6 more
TL;DR: In this article, an improved clamping ring apparatus is described for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer on a support pedestal to provide a peripheral seal between the Wafer and the surface of the pedestal facing the wafers.