A fast-Fourier-transform method of topography and interferometry is proposed. By computer processing of a noncontour type of fringe pattern, automatic discrimination is achieved between elevation and depression of the object or wave-front form, which has not been possible by the fringe-contour-generation techniques. The method has advantages over moire topography and conventional fringe-contour interferometry in both accuracy and sensitivity. Unlike fringe-scanning techniques, the method is easy to apply because it uses no moving components.

Fourier-transform method of fringe-pattern analysis for computer-based topography and interferometry

The term photonic crystals appears because of the analogy between electron waves in crystals and the light waves in artificial periodic dielectric structures. During the recent years the investigation of one-, two-and three-dimensional periodic structures has attracted a widespread attention of the world optics community because of great potentiality of such structures in advanced applied optical fields. The interest in periodic structures has been stimulated by the fast development of semiconductor technology that now allows the fabrication of artificial structures, whose period is comparable with the wavelength of light in the visible and infrared ranges.

http://ieeexplore.ieee.org/iel5/6354/16969/00781867.pdf

Photonic crystals

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Principles Of Optics Electromagnetic Theory Of Propagation Interference And Diffraction Of Light

The various arguments for introducing optical interconnections to silicon CMOS chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed. Optics could solve many physical problems of interconnects, including precise clock distribution, system synchronization (allowing larger synchronous zones, both on-chip and between chips), bandwidth and density of long interconnections, and reduction of power dissipation. Optics may relieve a broad range of design problems, such as crosstalk, voltage isolation, wave reflection, impedence matching, and pin inductance. It may allow continued scaling of existing architectures and enable novel highly interconnected or high-bandwidth architectures. No physical breakthrough is required to implement dense optical interconnects to silicon chips, though substantial technological work remains. Cost is a significant barrier to practical introduction, though revolutionary approaches exist that might achieve economies of scale. An Appendix analyzes scaling of on-chop global electrical interconnects, including line inductance and the skin effect, both of which impose significant additional constraints on future interconnects.

/pdf/rationale-and-challenges-for-optical-interconnects-to-5clh2238g9.pdf

Rationale and challenges for optical interconnects to electronic chips

Today cross-cutting approaches, where molecular engineering and clever processing are synergistically coupled, allow the chemist to tailor complex hybrid systems of various shapes with perfect mastery at different size scales, composition, functionality, and morphology. Hybrid materials with organic–inorganic or bio–inorganic character represent not only a new field of basic research but also, via their remarkable new properties and multifunctional nature, hybrids offer prospects for many new applications in extremely diverse fields. The description and discussion of the major applications of hybrid inorganic–organic (or biologic) materials are the major topic of this critical review. Indeed, today the very large set of accessible hybrid materials span a wide spectrum of properties which yield the emergence of innovative industrial applications in various domains such as optics, micro-electronics, transportation, health, energy, housing, and the environment among others (526 references).

Applications of advanced hybrid organic–inorganic nanomaterials: from laboratory to market

Microoptics: SINZINGER:MICROOPTICS 2ED O-BK

An integrated free-space optical interconnection system with 2500 parallel data channels is demonstrated. The design is based on a combination of microchannel imaging and conventional imaging. A modification of the hybrid imaging configuration allows one to achieve optimized image quality over large image fields.

/pdf/integrated-micro-optical-imaging-system-with-a-high-1ybqxjdt44.pdf

Integrated micro-optical imaging system with a high interconnection capacity fabricated in planar optics

Lens array arrangements are commonly used for the homogenization of highly coherent laser beams. These fly's eye condenser configurations can be used to shape almost arbitrary input intensity distributions into a top hat. Due to the periodic structure of regular arrays the output intensity distribution is modulated by equidistant sharp intensity peaks which are disturbing the homogeneity. As a new approach we apply chirped microlens arrays to the beam shaping system. These are non-regular arrays consisting of individually shaped lenses defined by a parametric description which can be derived completely from analytical functions. The advantages of the new concept and design rules are presented.

Beam homogenizers based on chirped microlens arrays

Optical components are usually classified into diffractive and refractive elements. In this classification, refractive components are defined as elements that are sufficiently described by geometrical optics. For micro-optics this distinction is very often not applicable. Our goal is to understand which parameters control the transition from elements that can be interpreted as refractive to those elements that are called diffractive. We investigate the linear blazed grating and focus on the wavelength dependence of its properties. For this we adopt an approach well known from the theory of echelette gratings. Our results can easily be transferred to other blazed components, such as Fresnel lenses.

Transition between diffractive and refractive micro-optical components

A method based on subaperture stitching for measurement of a freeform wavefront is proposed and applied to wavefronts calculated from the slope data acquired using a scanning Shack Hartmann sensor (SHS). The entire wavefront is divided into a number of subapertures with overlapping zones. Each subaperture is measured using the SHS, which is scanned over the entire wavefront. The slope values and thus the phase values of separately measured subapertures cannot be connected directly due to various misalignment errors during the scanning process. The errors lying in the vertical plane, i.e., piston, tilt, and power, are minimized by fitting them in the overlapping zone. The radial and rotational misalignment errors are minimized during registration in the global frame by using active numerical alignment before the stitching process. A mathematical model for a stitching algorithm is developed. Simulation studies are presented based on the mathematical model. The proposed mathematical model is experimentally verified on freeform surfaces of a cubic phase profile.

Stefan Sinzinger

Papers

Microoptics: SINZINGER:MICROOPTICS 2ED O-BK

Integrated micro-optical imaging system with a high interconnection capacity fabricated in planar optics

Beam homogenizers based on chirped microlens arrays

Transition between diffractive and refractive micro-optical components

Subaperture stitching for measurement of freeform wavefront.