Computational geometry

IEEE transactions on computer-aided design of integrated circuits and systems : a publication of the IEEE Circuits and Systems Society

This book provides broad and comprehensive coverage of the entire EDA flow. EDA/VLSI practitioners and researchers in need of fluency in an "adjacent" field will find this an invaluable reference to the basic EDA concepts, principles, data structures, algorithms, and architectures for the design, verification, and test of VLSI circuits. Anyone who needs to learn the concepts, principles, data structures, algorithms, and architectures of the EDA flow will benefit from this book.


Covers complete spectrum of the EDA flow, from ESL design modeling to logic/test synthesis, verification, physical design, and test - helps EDA newcomers to get "up-and-running" quickly 
Includes comprehensive coverage of EDA concepts, principles, data structures, algorithms, and architectures - helps all readers improve their VLSI design competence 
Contains latest advancements not yet available in other books, including Test compression, ESL design modeling, large-scale floorplanning, placement, routing, synthesis of clock and power/ground networks - helps readers to design/develop testable chips or products 
Includes industry best-practices wherever appropriate in most chapters - helps readers avoid costly mistakes



Table of Contents


Chapter 1: Introduction Chapter 2: Fundamentals of CMOS Design Chapter 3: Design for Testability Chapter 4: Fundamentals of Algorithms Chapter 5: Electronic System-Level Design and High-Level Synthesis Chapter 6: Logic Synthesis in a Nutshell Chapter 7: Test Synthesis Chapter 8: Logic and Circuit Simulation Chapter 9:?Functional Verification Chapter 10: Floorplanning Chapter 11: Placement Chapter 12: Global and Detailed Routing Chapter 13: Synthesis of Clock and Power/Ground Networks Chapter 14: Fault Simulation and Test Generation.

Electronic Design Automation: Synthesis, Verification, and Test

The increasing complexity of interconnection designs has enhanced the importance of research into global routing when seeking high-routability (low overflow) results or rapid search paths that report wirelength estimations to a placer. This work presents two routing techniques, namely circular fixed-ordering monotonic routing and evolution-based rip-up and rerouting using a two-stage cost function in a high-performance congestion-driven 2-D global router. We also propose two efficient via-minimization methods, namely congestion relaxation by layer shifting and rip-up and reassignment, for a dynamic programming-based layer assignment. Experimental results demonstrate that our router achieves performance similar to the first two winning routers in ISPD 2008 Routing Contest in terms of both routability and wirelength at a 1.05 × and 18.47 × faster routing speed. Moreover, the proposed layer assignment achieves fewer vias and shorter wirelength than congestion-constrained layer assignment (COLA).

https://ir.nctu.edu.tw:443/bitstream/11536/15610/1/000300511600007.pdf

NCTU-GR: Efficient Simulated Evolution-Based Rerouting and Congestion-Relaxed Layer Assignment on 3-D Global Routing

Global routing is an important step for physical design. In this paper, we develop a new global router, NTUgr, that contains three major steps: prerouting, initial routing, and enhanced iterative negotiation-based rip-up/rerouting (INR). The prerouting employs a two-stage technique of congestion-hotspot historical cost pre-increment followed by small bounding-box area routing. The initial routing is based on efficient iterative monotonic routing. For traditional INR, it has evolved as the main stream for the state-of-the-art global routers, which reveals its great ability to reduce the congestion and overflow. As pointed out by recent works, however, traditional INR may get stuck at local optima as the number of iterations increases. To remedy this deficiency, we replace INR by enhanced iterative forbidden-region rip-up/rerouting (IFR) which features three new techniques of (1) multiple forbidden regions expansion, (2) critical subnet rerouting selection, and (3) look-ahead historical cost increment. Experimental results show that NTUgr achieves high-quality results for the ISPD'07 and ISPD'08 benchmarks for both overflow and runtime.

High-performance global routing with fast overflow reduction

As nanometer technology advances, the post chemical-mechanical polishing (CMP) topography variation control becomes crucial for manufacturing closure. To improve the CMP quality, dummy-feature filling is typically performed by foundries after the routing stage. However, filling dummy features may greatly degrade the interconnect performance and significantly increase the input data in the following time-consuming reticle enhancement techniques. It is, thus, desirable to consider wire-density uniformity during routing to minimize the side effects from aggressive post-layout dummy filling. In this paper, we present a new full-chip grid-based routing system considering wire density for reticle planarization enhancement. To fully consider a wire distribution, the router applies a novel two-pass top-down planarity-driven routing framework, which employs new density critical area analysis based on Voronoi diagrams and incorporates an intermediate stage of a density-driven layer/track assignment based on incremental Delaunay triangulation. Experimental results show that our methods can achieve a more balanced wire distribution than state-of-the-art works.

/pdf/a-novel-wire-density-driven-full-chip-routing-system-for-cmp-4r2imtluuo.pdf

A Novel Wire-Density-Driven Full-Chip Routing System for CMP Variation Control

In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase interconnect coupling capacitance and thus circuit delay, and might also lead to explosion of mask data due to the extra layout patterns. Traditional dummy-fill algorithms try to make each tile (window) density satisfy foundry's density upper and lower bounds under the coupling constraint. As technology advances, however, it is not sufficient to just keep the pattern density variation of each layer within density bounds. The density gradient, besides the density variation, plays a pivotal role in determining the post-CMP thickness of modern circuit designs. In this paper, we present the first gradient-driven dummy-fill algorithm to address the density gradient and other classical objectives (such as density variation, coupling constraints, dummy count) as well. Our dummy-fill algorithm has the two distinguished features: (1) Gaussian smoothing based gradient-driven multilevel dummy density analysis to minimize density gradient level by level, and (2) ILP-based fill synthesis to insert the fewest dummies within the coupling-violation-free feasible regions while satisfying the density constraints. Experimental results show that our algorithm can achieve promising results by inserting minimal dummies to reduce the density gradient and variation under the coupling constraints with a reasonable runtime overhead.

http://eda.ee.ntu.edu.tw/~yellowfish/ispd10/ispd10.pdf

Density gradient minimization with coupling-constrained dummy fill for CMP control

As nanometer technology advances, the post-CMP dielectric thickness variation control becomes crucial for manufacturing closure. To improve CMP quality, dummy feature filling is typically performed by foundries after the routing stage. However, filling dummy features may greatly degrade the interconnect performance and lead to explosion of mask data. It is thus desirable to consider wire-density uniformity during routing to minimize the side effects from aggressive post-layout dummy filling. In this paper, we present a new full-chip grid-based routing system considering wire density for reticle planarization enhancement. To fully consider wire distribution, the router applies a novel two-pass, top-down planarity-driven routing framework, which employs a new density critical area analysis based on Voronoi diagrams and incorporates an intermediate stage of density-driven layer/track assignment based on incremental Delaunay triangulation. Experimental results show that our methods can achieve more balanced wire distribution than state-of-the-art works.

/pdf/novel-wire-density-driven-full-chip-routing-for-cmp-izdqefm2ts.pdf

Novel wire density driven full-chip routing for CMP variation control

The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer-circuit design. High voltages that resulted from ESD might cause high current densities in a small device and burn it out, so on-chip protection circuits for IC pads are required. To reduce the design cost, the protection circuit should be added only for the IC pads with an ESD current path, which causes the ESD current path analysis problem. In this paper, we first introduce the analysis problem for ESD protection in circuit design. We then model the circuit as a constraint graph, decompose the ESD connected components (ECCs) linked with the pads, and apply breadth-first search (BFS) to identify the ECCs in each constraint graph and, thus, the current paths. Experimental results show that our algorithm can very efficiently and economically detect all ESD paths. For example, our algorithm can detect all ESD paths in a circuit with more than 1.3 million vertices in 1.39 s and consume only 44-MB memory on a 3.0-GHz Intel Pentium 4 PC. To the best of our knowledge, our algorithm is the first point tool available to the public for the ESD analysis.

/pdf/an-efficient-graph-based-algorithm-for-esd-current-path-1xexusq08c.pdf

An Efficient Graph-Based Algorithm for ESD Current Path Analysis

The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer circuit design. High voltages resulted from ESD might cause high current densities in a small device and burn it out, so on-chip protection circuits for IC pads are required. To reduce the design cost, the protection circuit should be added only for the IC pads with an ESD current path, which arises the ESD current path analysis problem. In this paper, we first introduce the analysis problem for ESD protection in circuit design. We then model the circuit as a constrained graph, decompose ESD connected components linked with the pads, and apply the breadth-first search (BFS) to identify the ESD connected components in each constrained graph and thus the current paths. Experimental results show that our algorithm can detect all ESD paths very efficiently and economically. To our best knowledge, our algorithm is the first point tool available to the public for the ESD analysis.

/pdf/current-path-analysis-for-electrostatic-discharge-protection-6pd52kfb2y.pdf

Szu-Jui Chou

Papers

A Novel Wire-Density-Driven Full-Chip Routing System for CMP Variation Control

Density gradient minimization with coupling-constrained dummy fill for CMP control

Novel wire density driven full-chip routing for CMP variation control

An Efficient Graph-Based Algorithm for ESD Current Path Analysis

Current path analysis for electrostatic discharge protection