A digitally modulated power amplifier (DPA) in 1.2 V 0.13 mum SOI CMOS is presented, to be used as a building block in multi-standard, multi-band polar transmitters. It performs direct amplitude modulation of an input RF carrier by digitally controlling an array of 127 unary-weighted and three binary-weighted elementary gain cells. The DPA is based on a novel two-stage topology, which allows seamless operation from 800 MHz through 2 GHz, with a full-power efficiency larger than 40% and a 25.2 dBm maximum envelope power. Adaptive digital predistortion is exploited for DPA linearization. The circuit is thus able to reconstruct 21.7 dBm WCDMA/EDGE signals at 1.9 GHz with 38% efficiency and a higher than 10 dB margin on all spectral specifications. As a result of the digital modulation technique, a higher than 20.1 % efficiency is guaranteed for WCDMA signals with a peak-to-average power ratio as high as 10.8 dB. Furthermore, a 15.3 dBm, 5 MHz WiMAX OFDM signal is successfully reconstructed with a 22% efficiency and 1.53% rms EVM. A high 10-bit nominal resolution enables a wide-range TX power control strategy to be implemented, which greatly minimizes the quiescent consumption down to 10 mW. A 16.4% CDMA average efficiency is thus obtained across a > 70 dB power control range, while complying with all the spectral specifications.

A 25 dBm Digitally Modulated CMOS Power Amplifier for WCDMA/EDGE/OFDM With Adaptive Digital Predistortion and Efficient Power Control

This paper presents a directly modulated, 60 GHz zero-IF transceiver architecture suitable for single-carrier, low-power, multi-gigabit wireless links in nanoscale CMOS technologies. This mm-wave front end architecture requires no upconversion of the baseband signals in the transmitter and no analog-to-digital conversion in the receiver, thus minimizing system complexity and power consumption. All circuit blocks are realized using sub-1.0 V topologies, that feature only a single high-frequency transistor between the supply and ground, and which are scalable to future 45 nm, 32 nm, and 22 nm CMOS nodes. The transceiver is fabricated in a 65 nm CMOS process with a digital back-end. It includes a receiver with 14.7 dB gain and 5.6 dB noise figure, a 60 GHz LO distribution tree, a 69 GHz static frequency divider, and a direct BPSK modulator operating over the 55-65 GHz band at data rates exceeding 6 Gb/s. With both the transmitter and the receiver turned on, the chip consumes 374 mW from 1.2 V which reduces to 232 mW for a 1.0 V supply. It occupies 1.28 times 0.81 mm2. The transceiver and its building blocks were characterized over temperature up to 85deg C and for power supplies down to 1 V. A manufacturability study of 60 GHz radio circuits is presented with measurements of transistors, the low-noise amplifier, and the receiver on slow, typical, and fast process splits. The transceiver architecture and performance were validated in a 1-6 Gb/s 2-meter wireless transmit-receive link over the 55-64 GHz range.

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A Zero-IF 60 GHz 65 nm CMOS Transceiver With Direct BPSK Modulation Demonstrating up to 6 Gb/s Data Rates Over a 2 m Wireless Link

A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave and optical fiber circuits using nanoscale CMOS, SiGe BiCMOS and III-V technologies. Step-by-step design methodologies, end-of-chapter problems and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.

High-Frequency Integrated Circuits

A converter circuit and related technique for providing high power density power conversion includes a reconfigurable switched capacitor transformation stage coupled to a magnetic converter (or regulation) stage. The circuits and techniques achieve high performance over a wide input voltage range or a wide output voltage range. The converter can be used, for example, to power logic devices in portable battery operated devices.

Power Converter With Capacitive Energy Transfer And Fast Dynamic Response

The constantly growing quest for global roaming with a fast mobile internet access has further increased demand for multiband 3G cell phones supporting also 2G/2.5G standards, in order to provide full coverage any time, any place. In order to substantially reduce cost and size of the multimode, multiband handsets, it is necessary to develop a transmitter architecture that enables use of a multimode, multiband power amplifier, a key prerequisite to substantially reduce the number of external components, pins count, and PCB area, while at the same time significantly lowering power consumption.

A fully digital multimode polar transmitter employing 17b RF DAC in 3G mode

This paper presents a system-independent transmitter architecture based on a direct-digital RF-modulator which combines the D/A conversion, up-conversion, unwanted sideband rejection, power control, and part of the digital image-rejection filtering into a single mixed-signal circuit block. The multimode capability of the architecture is demonstrated with WCDMA, EDGE, and WLAN system requirements. The modulator achieves 90 dB of power control range and with an external power amplifier module, WCDMA EVM of less than 2% from signal powers of -20 dBm to +25 dBm. The noise floor level defined by the quantization noise at 190 MHz offset from the carrier is -150 dBc/Hz measured at the output of the PA with +25 dBm signal power. The analog power consumption with the maximum signal power level is 92 mW and scales down to 46 mW when reducing the signal level to -43 dBFS. The digital power consumption is 65 mW. The chip is implemented with a standard 0.13 mum 1.2 V digital CMOS with total silicon area of 4 mm2.

T. Saarela

Papers

A Multimode Transmitter in 0.13 $\mu\hbox{m}$ CMOS Using Direct-Digital RF Modulator