T
Takahashi Takahiko
Researcher at Hitachi
Publications - 92
Citations - 807
Takahashi Takahiko is an academic researcher from Hitachi. The author has contributed to research in topics: Ion beam & Layer (electronics). The author has an hindex of 13, co-authored 92 publications receiving 807 citations.
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Patent
Multilayered device micro etching method and system
TL;DR: In this paper, the authors proposed a micro-e etching method for locally reactive etching by irradiating to a multilayered workpiece reactive beam generated by extracting the reactant gas ionized or ionizing the reactive beam.
Patent
Semiconductor integrated circuit device and process for producing the same
Takahashi Takahiko,Funikazu Itoh,Akira Shimase,Hiroshi Yamaguchi,Mikio Hongo,Haraichi Satoshi +5 more
TL;DR: In this article, a hole is bored in an insulating film above a portion of a wiring which is to be connected to another wiring by means of a focused ion beam, and a predetermined region is irradiated with either a laser beam or an ion beam in a metal compound gas to deposit metal in the hole and on said region and a connecting wiring is formed by using optically pumped CVD.
Patent
Processing method and apparatus using focused energy beam
Junzou Azuma,Fumikazu Itoh,Haraichi Satoshi,Akira Shimase,Mori Junichi,Takahashi Takahiko,Emiko Uda +6 more
TL;DR: In this paper, a focused energy beam was used for conducting local energy beam processing in an irradiating area by irradiating a sample with an ion beam or an electron beam in an etching gas atmosphere.
Patent
Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams
Takahashi Takahiko,Fumikazu Itoh,Akira Shimase,Mikio Hongo,Haraichi Satoshi,Hiroshi Yamaguchi +5 more
TL;DR: In this article, a variety of techniques relating to the wiring and logic corrections on a chip by making use of the focused ion beam (which is shortly referred to as “FIB”) or the laser selection metal CVD are presented.
Patent
IC wiring connecting method and resulting article
Hiroshi Yamaguchi,Mikio Hongo,Takeoki Miyauchi,Akira Shimase,Haraichi Satoshi,Takahashi Takahiko,Keiya Saito +6 more
TL;DR: In this article, an IC wiring connecting method for interconnecting conductive lines of the same wiring plane of an IC chip for correcting the wiring, for connecting a conductive line of different wiring lanes of a multilayer IC chip at the same position, or for connecting an IC line formed at a separate position on the same multi-layer IC chip.