F
Fumikazu Itoh
Researcher at Hitachi
Publications - 17
Citations - 527
Fumikazu Itoh is an academic researcher from Hitachi. The author has contributed to research in topics: Focused ion beam & Ion beam. The author has an hindex of 11, co-authored 17 publications receiving 526 citations.
Papers
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Patent
Process method and apparatus using focused ion beam generating means
Michinobu Mizumura,Yuuichi Hamamura,Junzou Azuma,Akira Shimase,Kamimura Takashi,Fumikazu Itoh,Kaoru Umemura,Yoshimi Kawanami,Yuuichi Madokoro +8 more
TL;DR: In this paper, a focused ion beam is irradiated onto a silicon wafer or device to conduct on a particular position of the sample a fine machining work, a fine layer accumulation, and an analysis.
Patent
Processing method and apparatus using focused energy beam
Junzou Azuma,Fumikazu Itoh,Haraichi Satoshi,Akira Shimase,Mori Junichi,Takahashi Takahiko,Emiko Uda +6 more
TL;DR: In this paper, a focused energy beam was used for conducting local energy beam processing in an irradiating area by irradiating a sample with an ion beam or an electron beam in an etching gas atmosphere.
Patent
Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams
Takahashi Takahiko,Fumikazu Itoh,Akira Shimase,Mikio Hongo,Haraichi Satoshi,Hiroshi Yamaguchi +5 more
TL;DR: In this article, a variety of techniques relating to the wiring and logic corrections on a chip by making use of the focused ion beam (which is shortly referred to as “FIB”) or the laser selection metal CVD are presented.
Patent
Method of etching a semiconductor device by an ion beam
TL;DR: In this paper, a method of etching a semiconductor device having multi-layered wiring by an ion beam is disclosed which comprises the steps of: extracting a high intensity ion beam from a high-density ion source; focusing the extracted ion beam; causing the focused ion beam to perform a scanning operation by a voltage applied to a deflection electrode; forming a first hole in the semiconductor devices by the focused Ion beam to a depth capable of reaching an insulating film formed between upper and lower wiring conductors so that the first hole has a curved bottom corresponding to the und
Journal ArticleDOI
Practical phase‐shifting mask technology for 0.3 μm large scale integrations
Fumio Mizuno,Noboru Moriuchi,Morihisa Hoga,Yasuhiro Koizumi,Osamu Suga,Hidehiko Nakaune,Kamiyama Kazumi,Norio Hasegawa,Fumio Murai,Fumikazu Itoh +9 more
TL;DR: In this article, an i−line phase-shifting mask technology intended for practical use has been developed, which can provide defect-free phaseshifting masks and can produce 0.3 μm large scale integration with large lithographic latitudes.