Tapano Kumar Hotta

TL;DR: In this paper, the experimental and statistical analysis of flank wear, material removal rate, tool tip temperature, surface roughness parameters (i.e., Ra, Rz and Rt), chip morphology, chip thickness and dimensional deviations were presented.

TL;DR: In this paper, the authors investigate numerically the mixed convection heat transfer characteristics from seven non-identical IC chips (Aluminium) mounted on a Switch Mode Power Supply (SMPS) board (substrate) made by FR-4 (glass-reinforced epoxy laminate material).

Abstract: The paper aims at the transient numerical modelling under mixed convection for the cooling of seven protruding asymmetric IC chips mounted on an SMPS board using the phase change material (n-eicosane). The phase change material (PCM) is kept inside the mini-channels fabricated on the board. The objective is to bring down the temperature (minimize the maximum temperature) of the configuration (SMPS board with 7 IC chips) using the n-eicosane inside the mini-channels. It is seen that n-eicosane absorbs the heat dissipated by the IC chips and thus the maximum temperature of the configuration reduces by 5.5%. The effect of channel hydraulic diameter (2.5 mm ≤ Dh ≤ 3.5 mm) on the temperature of the IC chips is also studied. The results suggest that the mini-channel with lower hydraulic diameter gives a better rate of heat transfer from the IC chips and thus cools these effectively. The study is extended using four different phase change materials out of which, n-eicosane has resulted in maximum temperature drop from the IC chips among different PCMs due to its lower melting point value. A correlation is proposed for the non-dimensional temperature (θ) of the IC chips in terms of Fourier number (Fo) to predict the IC chip temperatures during the melting of PCM.

TL;DR: In this paper, a combined experimental methodology and optimization strategy of the process parameters for the turning of Nimonic C-263 superalloy with a multilayer CVD coating using TiN-MT-TiCN-Al2O3 grade KCM25 inserts is proposed.

TL;DR: In this article, an empirical correlation has been proposed between the non-dimensional steady state temperature (θ) and λ, by taking into account the effect of surface radiation heat transfer.