V. K. Mathew

TL;DR: In this paper, the authors investigate numerically the mixed convection heat transfer characteristics from seven non-identical IC chips (Aluminium) mounted on a Switch Mode Power Supply (SMPS) board (substrate) made by FR-4 (glass-reinforced epoxy laminate material).

TL;DR: In this paper, two mini-channels (left and right) are fabricated at the periphery of the substrate board and filled with the Paraffin wax, and the IC chips are placed adjacent to these channels and supplied with non-uniform heat inputs leading to the constant volumetric heat generation.

TL;DR: A passive phase change material cooling strategy is proposed which can utilize the advantage of isotopic heat conduction from the electronic element to give an optimum cooling strategy over the electronic aspect which help in keeping the temperature of the electronicelement below 85 °C.

TL;DR: In this article, the authors performed PCM-based passive thermal management study over 60 Cell 18,650 lithium-ion battery packs which are considered to be working for automobile applications, and the output field results from numerical investigation are predicted using neural network approach in which a multi-objective optimization strategy is proposed between battery pack delay effect for selected paraffin wax and RT-18 PCM against its given C-rate.

TL;DR: In this article, steady-state experiments are conducted under the laminar forced convection heat transfer mode for cooling of seven asymmetric IC chips (heat sources) mounted at different positions on the substructure.