T
Tohru Suwa
Researcher at President University
Publications - 29
Citations - 210
Tohru Suwa is an academic researcher from President University. The author has contributed to research in topics: Multidisciplinary design optimization & Artificial neural network. The author has an hindex of 7, co-authored 28 publications receiving 150 citations. Previous affiliations of Tohru Suwa include Stevens Institute of Technology & Universiti Teknologi Malaysia.
Papers
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Sky image-based solar irradiance prediction methodologies using artificial neural networks
TL;DR: Two methodologies utilizing artificial neural networks (ANNs) to predict global horizontal irradiance in 1 to 5 minutes in advance from sky images are proposed, able to capture the trends of fluctuating solar irradiance with minor discrepancies.
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Transient thermal prediction methodology for parabolic trough solar collector tube using artificial neural network
TL;DR: In this article, an artificial neural network (ANN) is combined with the principle of superposition to predict the exit temperature rise caused by a single heat flux pulse in the first step of the proposed methodology, while superposition is used to predict from multiple heat flux pulses in the second step.
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Multidisciplinary Placement Optimization of Heat Generating Electronic Components on a Printed Circuit Board in an Enclosure
Tohru Suwa,Hamid Hadim +1 more
TL;DR: In this article, a multidisciplinary placement optimization methodology for heat generating electronic components on a printed circuit board (PCB) subjected to forced convection in an enclosure is presented, which consists of a combination of artificial neural networks and a superposition method that is able to predict PCB surface and component junction temperatures in a much shorter calculation time than the existing numerical methods.
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Multidisciplinary Electronic Package Design and Optimization Methodology Based on Genetic Algorithm
Tohru Suwa,Hamid Hadim +1 more
TL;DR: In this article, a new multidisciplinary design and optimization methodology in electronics packaging is presented to improve the electronic package design process by performing multi-disciplinary design at an early design stage.
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Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
Hamid Hadim,Tohru Suwa +1 more
TL;DR: A state-of-the-art review of recent multidisciplinary design and optimization methodologies in electronics packaging is presented and methodologies using detailed numerical analysis models directly connected to optimization algorithms, and artificial neural networks have been proposed as new trends.