Showing papers by "Tomiya Sasaki published in 1994"

Heat radiating body having high thermal conductivity and its manufacture

Abstract: PURPOSE:To reduce the thermal contact resistance between a heat generating body and cooling parts by dispersing the powder of sintered aluminum nitride in the matrix of a flexible insulating material. CONSTITUTION:A module structure body 1a is constituted by mounting and sticking a TEG chip 3 for measuring thermal resistance of 10W in power consumption on and to the upper surface of a ceramic substrate 2 made of aluminum nitride as a semiconductor element 3. A heat radiating fin 4 is put on the upper surface of the chip 3 with a sheet-like heat radiating body 11 which has high thermal conductivity and in the resin matrix of which the powder of sintered aluminum nitride is dispersed and grease-like heat radiating body 12 having high thermal conductivity in between. Therefore, the thermal contact resistance between a heat generating body and cooling parts can be remarkably reduced when the heat radiating bodies 11 and 12 are interposed between them, because the bodies 11 and 12 have high coefficients of thermal conductivity, plasticity, and flexibility and the degree of contact between the bodies 11 and 12 is improved.

Heat radiation sheet

Abstract: PURPOSE:To provide a highly heat-conductive heat radiation sheet which ensures intimate contactness with a heating generating body, reduces a heat contact resistance between the heat generating body and a cooling component and improves heat radiation characteristic of the heat generating body. CONSTITUTION:A heat radiating sheet 5a is characterized in dispersing aluminum nitride powder particles into a matrix resin as a filler and including a plasticizer of 10 to 120wt.%. to amount of matrix resin. The preferable plasticizer should dissolve resin under the normal temperature and have the boiling point of 50 deg.C or higher. Moreover, the matrix resin should desirably be formed of a thermo setting resin. In addition, the recommended mean grain size of raw material powder particles of aluminum nitride, sintered aluminum nitride and alulminum nitride single crystal is 30mum or less. The recommended powder particles of sintered alulminum nitride or aluminum nitride single crystal should have a heat conductivity of 150W/m.K or higher.

Testing equipment of semiconductor device

Abstract: PURPOSE: To obtain testing equipment of a semiconductor device which enables execution of uniform and efficient cooling and of which maintenance and preparation are easy. CONSTITUTION: A flow passage pipe 18 through which a refrigerant flows is provided inside a circuit board holding body 16, while a cooling plate 26 of which the cooling surface 29 advances and withdraws in the direction of the surface of a circuit board is provided between circuit boards 24. By making the refrigerant from the flow passage pipe 18 flow through this cooling plate 26, the cooling surface 29 is brought into pressure contact with a large-scale integrated circuit device 25 so that it is connected to the device thermally. On the occasion of testing an integrated circuit device 33 of a semiconductor device to be tested, the cooling surface 29 of the cooling plate 26 is brought into pressure contact with the outer surface of the large-scale integrated circuit device 25 mounted on the circuit board 24 and thereby efficient cooling of the large-scale integrated circuit device 25 can be executed. On the occasion of replacement or checkup of the circuit board 24, the cooling surface 29 is made to withdraw by stopping flowing of the refrigerant, and it is possible to remove the cooling plate 26 simply from between the circuit boards and to execute easily checkup and preparation.

Multilayer wiring substrate

Abstract: PURPOSE:To provide excellent electric and thermal characteristic performances even though an ultra-high speed element having a large amount of heat generated, by using columnar thermal vias extended to a ceramic substrate and a heat sink located on the opposite surface of a ceramic substrate surface. CONSTITUTION:A multilayer wiring layer 2 is placed on an organic high polymer formed in one united body on an aluminum nitride ceramic substrate 1 and a ceramic substrate 1, and a die pad 2c is formed for attaching and mounting electronic parts located on the surface of the multilayer wiring layer 2. And the multilayer wiring substrate contains columnar thermal vias 4; one end of each via is connected to the die pad 2c, other end passes through the multilayer wiring layer 2, while being insulated electrically from this layer, and is extended to the ceramic wiring substrate 1; and each thermal via 4 efficiently radiate heat generated from a mounted electronic part 3. By doing this, a wiring layer with a low thermal resistance can be created and heat from the semiconductor element can be transmitted fairly well to the substrate.

Insulating heat radiating material for x-ray tube device

Abstract: PURPOSE:To efficiently disperse heat generated, and concurrently enable a device to be made small in size while the rotating efficiency of a rotor is being enhanced by letting insulating heat radiating material be composed of solid insulating material in which high heat conductive fillers are dispersed in base material composed of resin. CONSTITUTION:The device is equipped with insulating heat radiating material 17 which is molded in each gap between a device main body and each component. And the heat radiating material 17 is composed of solid insulating material 18 in which aluminum nitride sintered powder is dispersed as a high heat conductive filler into base material composed of epoxyresin. And a support insulating pipe 8a is also formed out of the insulating material 18. Since the insulating material 18 whose insulating proof strength and heat conductivity are equal to or more than those each of which is four timed as large as that of insulating oil, is used as the heat radiating material 17, each insulating distance among component parts such as a X-ray tube 3, a field coil 10 and the like can be made small, moreover, its cooling characteristics can also be improved. Therefore, the device can be made small in size and light in weight.