Showing papers by "Toshihiko Kosugi published in 2016"

Demonstration of 20-Gbps wireless data transmission at 300 GHz for KIOSK instant data downloading applications with InP MMICs

Abstract: We present 20-Gbps wireless ASK data transmission at 300 GHz with an all-electronic transmitter and receiver for KIOSK instant data downloading applications. The transmitter and receiver MMICs are based on 70-nm indium-phosphide-based high electron mobility transistor technologies of which the cut-off frequency (fmax) is approximately 700 GHz. For an experiment, the transmitter and receiver were packaged in a split-block waveguide and dedicated metallic housing, respectively. With 30-dBi and 25-dBi horn antennas for the transmitter and receiver, error free data transmission (bit error rate < 1 × 10−9) was achieved up to 80-cm link distance.

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

Abstract: Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm3. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.

20-Gbit/s ASK wireless system in 300-GHz-band and front-ends with InP MMICs

Abstract: We present a 20-Gbit/s ASK wireless system in the 300-GHz band for kiosk data downloading. The front-ends (transmitter and receiver) are manufactured by using InP-based monolithic microwave integrated circuits with high electron mobility transistors. We successfully demonstrate 20-Gbit/s data transmission using these front-ends at link distances from 50 cm to 1 m. The measured bit error rate is less than 10−6 up to the distance of 1 m.

Research and Development of InP, GaN and InSb-Based HEMTs and MMICs for Terahertz-Wave Wireless Communications

Abstract: We have improved the performances of InP-based HEMTs and MMICs for terahertz-wave wireless communications using a high frequency carrier wave around 300 GHz in an R&D program launched by the Ministry of Internal Affairs and Communications, Japan (MIC). Furthermore, we also have developed GaN and InSb-based HEMTs in another research. In this paper, we demonstrated the performances of InP, GaN and InSb-HEMTs, and InP-MMICs for power amplifier and low-noise amplifier operated around 300 GHz.