An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

The present invention provides a method and apparatus for the production and labeling of objects in a manner suitable for the prevention and detection of counterfeiting. Thus, the system incorporates a variety of features that make unauthorized reproduction difficult. In addition, the present invention provides an efficient means for the production of labels and verification of authenticity, whereby a recording apparatus which includes a recording medium, having anisotrophic optical domains, along with a means for transferring a portion of the recording medium to a carrier, wherein a bulk portion of the recording medium has macroscopically detectable anisotrophic optical properties and the detecting apparatus thereon.

Authentication method and system

Disclosed is a method for correcting a layout design using a design rule checker. The method includes providing a layout design file having the layout design that is to be corrected for optical proximity by the design rule checker. Providing a run set to the design rule checker. The run set includes a plurality of correction values that are used to correct a plurality of features of the layout design that have a selected space dimension. Identifying each of the plurality of features that have the selected space dimension. The method further includes correcting each of the plurality of features that have the selected space dimension with one correction value of the plurality of correction values of the run set. Preferably, the run set is generated from a correction table that has the plurality of correction values.

Optical proximity correction method and apparatus

A pattern inspection apparatus is used for inspecting a fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines, comprising one of a line segment and a curve, from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Pattern inspection apparatus and method

A system for tracking currency bills comprises a currency scanning device. The scanning device includes a sensor that retrieves currency identification characteristic information of each bill processed. The currency identification characteristic information permits the unique identification of each bill processed. The system further comprises a customer identification means and means for associating each processed bill with the customer depositing the bill. Means for identifying the customer (or customer account) associated with a particular processed bill after the deposit transaction has been completed is also included in the system.

Document processing system using full image scanning

A pattern inspection apparatus for comparing/collating a test target pattern with a corresponding design pattern to detect the presence/absence of a defect which is present in the test target pattern includes a bit pattern generating circuit for developing the data of the design pattern into bits, a corner pattern detector for scanning a corner pattern detection window having a predetermined range with respect to reference pattern data as a reference of a pattern obtained by bit development performed by the bit pattern generating circuit to extract a contour pattern, and detecting a corner pattern to be subjected to corner rounding processing on the basis of the extracted contour pattern, a memory for storing predetermined change information corresponding to the corner detected by the corner pattern detector, a graphic pattern synthesizing circuit for changing a graphic pattern in accordance with the information in the memory, and a comparing circuit for comparing reference pattern data, obtained by rounding processing performed on the basis of the reference pattern data and the feature of the corresponding pattern, with test pattern data obtained from the test target pattern, and further includes a pattern correcting circuit constituted by an excessive rounding detector for detecting and correcting an inadequate excessive rounding operation, and a pattern changing circuit for changing the pattern data in accordance with the excessive rounding detection result.

Pattern inspection apparatus with corner rounding of reference pattern data

A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.

Pattern inspection apparatus

In a method of inspecting a sample on which a pattern relating to fabrication of a semiconductor device is formed, there are provided a light radiation unit, an acquiring unit, a storage unit, a template, a calculation unit, a correction unit, a defect detection unit and an output unit Pinhole shape data to be detected of the pattern is stored in the template The calculation unit calculates the degree of coincidence between the pinhole shape data stored in the template and the measured image data stored in the storage unit in units of a predetermined amount of data The correction unit corrects a portion of the measured image data corresponding to a value of the degree of coincidence exceeding a second predetermined value in units of the predetermined amount of data, when the degree of coincidence obtained by the calculation unit has exceeded a first predetermined value, thereby correcting the portion of the measured image data including the detected pinhole The defect detection unit detects a defect in the pattern on the basis of the corrected measured image data portion including the pinhole, which is obtained by the correcting unit, and the measured image data

Sample inspection apparatus and sample inspection method

A displacement detection device which detects the displacement of a paper sheet in transit in a paper sheet sorter that picks up and transports the paper sheet such as the bank-notes. The displacement detection device includes photo sensors which detect the leading edge of the paper sheet that is being transported, and a photo position detector which detects the distance from the conveyer belt to the side edge of said paper sheet. Each of said photo sensors comprises of a light emitter and a light receiver which are arranged on opposite sides of the paper sheet. The photo position detector is placed on the downstream side in the conveyance direction of the photo sensors, extending perpendicularly to the conveyance line, and comprises a light projector and a light receiver with linear form and equal length arranged symmetrically with respect to the paper sheet. Signals from the photo sensors and photo position detector are processed by a microcomputer to determine the passing interval, the inclination, and the lateral shift of the paper sheet.

Method of and device for detecting displacement of paper sheets

A pattern defect inspection apparatus comprises a light irradiating portion, a light receive element, a light receive element amplifier, a preparation portion for preparing multi-valued design pattern image data, an offset adjusting portion, a gain adjusting portion, and an inspecting portion. The offset adjusting portion adjusts the offset of the light receive element amplifier such that measurement data of a translucent portion of a pattern on a sample surface corresponds to design pattern image data corresponding to the translucent portion, regarding the translucent portion as a non-transparent portion. The gain adjusting portion adjusts the gain of the light receive element amplifier such that measurement data of a transparent portion of the pattern on the sample surface corresponds to design pattern image data corresponding to the transparent portion.

Toshiyuki Watanabe

Papers

Pattern inspection apparatus with corner rounding of reference pattern data

Pattern inspection apparatus

Sample inspection apparatus and sample inspection method

Method of and device for detecting displacement of paper sheets

Method of inspecting a pattern formed on a sample for a defect, and an apparatus thereof