Due to the unprecedented growth in wireless applications over the past decade, development of low-cost solutions for RF and microwave communication systems has become of great importance. This practical new book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The books offers you an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Supported with over 220 equations and more than 200 illustrations, it covers the practical aspects of each element in exceptional detail. No other single volume treats this subject matter in such depth. From materials, fabrication, and analyses - to design, modeling, and physical, electrical, and thermal applications, this unique resource offers you complete coverage of the critical topics you need understand for your work in the field. Offering the most comprehensive, up-to-date body of knowledge on lumped elements, the book is an indispensable professional reference and serves as an excellent text for senior undergraduate and graduate-level courses in RF and microwave circuit design.

Lumped Elements for RF and Microwave Circuits

Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The IC fabricated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the IC chip substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.

Implantable medical device incorporating integrated circuit notch filters

A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Top layers of metal for high performance IC's

A dual-band antenna matching system and a method for dual-band impedance matching are provided. The method comprises: accepting a frequency-dependent impedance from an antenna; and, selectively supplying a conjugate impedance match for the antenna at either a first and a second communication band, or a third and a fourth communication band. More specifically, the method comprises: tuning a first tuning circuit to a first frequency; and, simultaneously tuning a second tuning circuit to a second frequency. In response, a conjugate match is supplied to the antenna in the first communication band in response to the first frequency. Simultaneously, the antenna is matched in the second communication band in response to the second frequency. When the first tuning circuit is tuned to a third frequency, and the second tuning circuit is tuned to a fourth frequency, then conjugate matches are supplied for the third and fourth communication bands, responsive to the third and fourth frequencies, respectively.

System and method for dual-band antenna matching

A fully integrated, programmable mixed-signal transceiver comprising a radio frequency integrated circuit (RFIC) which is frequency and protocol agnostic with digital inputs and outputs, the transceiver being programmable and configurable for multiple radio frequency bands and standards and being capable of connecting to many networks and service providers. The RFIC does not use spiral inductors and instead includes transmission line inductors allowing for improved scalability. Components of the transceiver are programmable to allow the transceiver to switch between different frequency bands of operating. Frequency switching can be accomplished though the content of digital registers coupled to the components.

Programmable radio transceiver

Very small multilayer MMICs (monolithic microwave integrated circuits) using miniature microstrip lines on a thin dielectric film are described Their configuration, loss characteristic, and dielectric materials (silicon oxynitride and polyinide) are discussed Other effective thin-film transmission lines, line crossovers, and vertical connections are also discussed Multiport Wilkinson dividers, 90 degrees and 180 degrees hybrids, and distributed amplifiers are implemented in an area of less than 1 mm/sup 2/ >

Multilayer MMIC using a 3 mu m*3-layer dielectric film structure

A multifrequency-band microstrip antenna, for use in microwave to millimeter-wave band, is provided with different thicknesses of dielectric films to optimized the performance in any operating frequencies desired. In a double lamination antena substrate, for example, lamination 1 is made up of a number of dielectric films having a given dielectric constant and thickness, and lamination 2 is made up of a number of dielectric films of another given dielectric constant and thickness. An radiation element is provided between the films in lamination 2 , and a ground plane is provided between the films in lamination 1 . A strip conductor for propagating radio signals is provided in lamination 1 such that the ground plane intervenes between the radiation element and the strip conductor, thereby shielding the radiation element except for a slot formed in the ground plane. The input signal couples to the radiation element through the slot, thereby feeding the radiation element and operating the microstrip antenna.

Heterogeneous multi-lamination microstrip antenna

This paper presents a simple and effective technique which compensates for the amplitude and phase differences of the Marchand balun. Compensation is accomplished by interconnecting a short transmission line to a pair of couplers. As a result, Marchand balun with operation frequency ranging as wide as 8.2-30 GHz is achieved. To fabricate the prototype, we adopt three-dimensional monolithic-microwave integrated-circuit technology together with a 2.5 /spl mu/m/spl times/4 layer polyimide structure stacked over a GaAs wafer. The topology yields a circuit area as small as 0.2 mm/spl times/0.4 mm for the balun.

Compact and broad-band three-dimensional MMIC balun

A novel T/R switch is proposed for high-power/low-distortion operation at a low control voltage. LC-resonant switches composed of inductors, capacitors, and switch FET's are incorporated in TX and RX arms to provide a reverse control scheme that removes the rf-voltage limitation in the transmit mode, A 1.9-GHz LC-resonant T/R switch MMIC with a total FET periphery of 3.36 mm exhibits 3rd IMR less than -40 dB for an input power up to 31 dBm when controlled at a V/-2 V. This MMIC occupies an area as small as less than 2/spl times/2 mm, This will make it possible to implement advanced T/R-switches at PCS and ISM frequencies below 5 GHz. >

A low-voltage, high-power T/R-switch MMIC using LC resonators

An MMIC magic T (180 degrees hybrid circuit) using microstrip lines on a thin silicon oxynitride (SiON) dielectric film is proposed. The microstrip-line area reduction is achieved by using thin-film microstrip lines, derived from the thin substrate structure, that have very narrow linewidths. The area is effectively minimized using meanderlike configurations. The SiON thin film is deposited by low-temperature plasma CVD (chemical vapor deposition). The MMIC magic T has been designed for a center frequency of 12 GHz, and small size with wideband performance from 6 GHz to 18 GHz has been achieved. Thus, magic T's using thin-film microstrip lines are promising for miniaturized high-performance MMICs, such as balanced mixers and modulators. >

Tsuneo Tokumitsu

Papers

Multilayer MMIC using a 3 mu m*3-layer dielectric film structure

Heterogeneous multi-lamination microstrip antenna

Compact and broad-band three-dimensional MMIC balun

A low-voltage, high-power T/R-switch MMIC using LC resonators

Very small wide-band MMIC magic T's using microstrip lines on a thin dielectric film