We propose the use of Ge $_{1-x}$ Sn $_x$ heterojunction phototransistors (HPTs) as efficient optical receivers on Si substrates and analyze their performance. Our designs use n-Ge/p-Ge $_{1-x}$ Sn $_x$ /n-Ge $_{1-x}$ Sn $_x$ layers pseudomorphically grown on Si wafers via a Ge virtual substrate, which offers compatibility with complementary metal–oxide–semiconductor (CMOS) technology. By incorporating Sn into the Ge photon-absorbing layer to shrink the bandgap, the photodetection range can be significantly extended to the mid-infrared (MIR) region with a considerably enhanced optical response. The use of HPT structures provides optical conversion gain to further enhance the optical responsivity, thereby enabling efficient photodetection in the short-wave infrared region. We develop theoretical models to calculate the composition-dependent band alignments, the band structures (by taking into account the nonparabolic effect), the absorption coefficient, and the optical responsivity for the proposed GeSn HPTs. As the Sn content increases, the conduction band nonparabolicity becomes increasingly significant and considerably impacts the optical absorption coefficient. Moreover, analysis of the spectral response for the Ge $_{1-x}$ Sn $_x$ HPTs shows that efficient photodetection covering the entirety of the fiber-optic telecommunication bands, as well as the emerging 2- $\mathbf {\mu }$ m MIR communication band, can be achieved. These results indicate that the proposed Ge $_{1-x}$ Sn $_x$ HPTs are attractive for use as high-responsivity CMOS-compatible photodetectors in communication applications.

Design and Modeling of GeSn-Based Heterojunction Phototransistors for Communication Applications

Alloys of Ge and Sn grown on Si platform show about tenfold increase in the absorption over Ge at C and L-bands due to the direct nature of the band gap in GeSn. This led us to propose a Ge/GeSn/GeSn heterophototransistor (HPT) structure on a Si-platform and to calculate the terminal currents, current gain, optical gain and responsivity of the device at $$1.55\,\upmu \mathrm{m}$$
 . The model developed by Frimel and Roenker for HPTs with InGaAs base is used. In the model, the carrier density in the base is obtained by matching the diffusion-limited current with the current due to thermionic emission and tunneling across the emitter-base heterobarrier, and also considering the carrier density at the collector-end limited by the saturation drift velocity. The contribution of holes to the current is also included. The resulting carrier distribution is used to express the terminal currents and calculate the values of gain. The band gap for GeSn and the band discontinuity in the heterobarrier are calculated by using model solid theory. The calculated values for the GeSn HPT are found to be comparable with and even better than the corresponding values for the InP/InGaAs/InGaAs Npn device for lower values of the base thickness and the base doping.

Predicted performance of Ge/GeSn hetero-phototransistors on Si substrate at 1.55\,\upmu \mathrm{m}

Optical properties of germanium tin (Ge1−x
 Sn
 x
 ) alloys have been comprehensively studied with Sn compositions from 0 (Ge) to 12%. Raman spectra of the GeSn samples with various Sn compositions were measured. The room temperature photoluminescence (PL) spectra show a gradual shift of emission peaks towards longer wavelength as Sn composition increases. Temperature dependent PL shows the PL intensity variation along with the temperature change, which reveals the indirectness or directness of the bandgap of the material. As temperature decreases, the PL intensity decreases with Sn composition less than 8%, indicating the indirect bandgap Ge1−x
 Sn
 x
 ; while the PL intensity increases with Sn composition higher than 10%, implying the direct bandgap Ge1−x
 Sn
 x
 . Moreover, the PL study of n-doped samples shows bandgap narrowing compared to the unintentionally (Boron) doped thin film with similar Sn compositions due to the doping.

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Optical Characterization of Si-Based Ge1−x Sn x Alloys with Sn Compositions up to 12%

Group IV semiconductor-based alloy Ge1−xSnx can be grown on Si platform and a crossover from indirect (L valleys) to direct gap (Γ valley) occurs for x > 0.08. The direct gap alloy shows promise for use in high-speed electronic and photonic devices. An earlier study predicted that the electron mobility in the alloy would increase by a few orders of magnitude above the value for pure Ge. In that work, however, electrons were assumed to occupy only the low effective mass Γ valley and only the deformation potential acoustic phonon and alloy scatterings were considered. In the present work, we give a more realistic estimate of the values of electron mobility in direct gap GeSn alloy, considering the Γ and L valleys and the phonon (deformation potential acoustic, optical and intervalley), alloy, and impurity scatterings. The effect of strain, both tensile and compressive, on the mobility is also studied. It is found that for higher alloy composition and suitable strain, mobility values ∼2 × 105 cm−2/V · s, more than 50 times higher than the value in pure Ge (3900 cm2/V · s) may be achieved. This is attributed to increased separation between Γ and L valleys and consequent reduction in intervalley scattering.

Prediction of Large Enhancement of Electron Mobility in Direct Gap Ge1−xSnx Alloy

Metal-semiconductor-metal photodetectors (MSM PDs) are effective for monolithic integration with other optical components of the photonic circuits because of the planar fabrication technique. In this article, we present the design, growth, and characterization of GeSn MSM PDs that are suitable for photonic integrated circuits. The introduction of 4% Sn in the GeSn active region also reduces the direct bandgap and shows a redshift in the optical responsivity spectra, which can extend up to 1800 nm wavelength, which means it can cover the entire telecommunication bands. The spectral responsivity increases with an increase in bias voltage caused by the high electric field, which enhances the carrier generation rate and the carrier collection efficiency. Therefore, the GeSn MSM PDs can be a suitable device for a wide range of short-wave infrared (SWIR) applications.

/pdf/metal-semiconductor-metal-gesn-photodetectors-on-silicon-for-4znh2sm75c.pdf

Metal-Semiconductor-Metal GeSn Photodetectors on Silicon for Short-Wave Infrared Applications.

Alloys of Ge and Sn grown on Si platform show about tenfold increase in absorption over Ge at L-band due to direct nature of the band gap We have made use of it by designing a Ge/GeSn/GeSn heterophototransistor on Si A thermionic-field-diffusion model is employed to calculate the current, optical gain and responsivity The values are comparable with those for InP/InGaAs/InGaAs Npn devices

http://ieeexplore.ieee.org/iel7/6723859/6733445/06733553.pdf

Predicted performance of Ge/GeSn hetero-phototransistors on Si substrate at 1.55 µm

The absorption spectra in strain-free Ge 0.992 Sn 0.008 /Si 0.3 Ge 0.61 Sn 0.09 Quantum Well structure due to direct gap excitons formed in Ge 0.992 Sn 0.008 wells reported by Chang and Chang are reproduced by an empirical expression. Two Gaussian distributions for heavy hole and light hole excitons and two exponential functions describing continuum transitions and The Sommerfeld factors are used for the fit. The expressions are then used to obtain the change in refractive index, Δ n , with field (electrorefraction) using the Kramers–Kronig relation. With the calculated changes in absorption and refraction with bias, other performance parameters of an Electro-Absorption Modulator (EAM), like extinction ratio, chirp parameter, and a figure of merit (FoM) defined as the ratio of extinction coefficient and insertion loss, are evaluated. The FoM takes the largest value for 1 μm length of the EAM with 2 V bias applied to the p–i–n structure. The parameters are also calculated for different wavelengths as well as detuning lengths. For applications as short pulse generation the transmission T as a function of bias V should be linear. We have evaluated the best value of bias voltage that makes the sum of second and third derivatives of T with V equal to zero so that the variation of T with V becomes maximally linear for optimum operation as a short pulse generator.

Performance prediction of an electroabsorption modulator at 1550 nm using GeSn/SiGeSn Quantum Well structure

This paper aims to provide the performance characteristics of proposed, strain balanced direct band gap multiple quantum wells (MQWs) hetero phototransistor (HPT) made of SiGeSn/GeSn alloys grown on Si substrate which is compatible with recent CMOS fabrication technology. This also presents a comprehensive comparison of this proposed structure with the existing HPT structure made of indirect gap Ge/SiGe MQWs. Alloys of Ge and Sn grown on Si platform shows about tenfold increase in absorption over Ge at C and L-bands due to direct nature of band gap in GeSn. Initial work begins the solution of continuity equation to solve the different terminal current densities and optical gain of the multiple quantum well structure. Main analysis was concentrated on finding the external quantum efficiency depending on the doping variations of emitter and base, base width etc. Finally the photocurrent density variations are estimated for the structure and compared with existing indirect band gap HPT. The calculated values for direct band gap GeSn HPT device are found to be comparable with those for indirect band gap SiGe device to flourish as a potential candidate of photo detectors for the present day telecommunication network.

Vedatrayee Chakraborty

Papers

Predicted performance of Ge/GeSn hetero-phototransistors on Si substrate at 1.55\,\upmu \mathrm{m}

Predicted performance of Ge/GeSn hetero-phototransistors on Si substrate at 1.55 µm

Performance prediction of an electroabsorption modulator at 1550 nm using GeSn/SiGeSn Quantum Well structure

Current gain and external quantum efficiency modeling of GeSn based direct bandgap multiple quantum well heterojunction phototransistor

Calculated Characteristics of a Transistor Laser Using Alloys of Gr‐IV Elements