Heterogeneous integration of III-V materials onto silicon photonics has experienced enormous progress in the last few years, setting the groundwork for the implementation of complex on-chip optical systems that go beyond single device performance. Recent advances on the field are expected to impact the next generation of optical communications to attain low power, high efficiency and portable solutions. To accomplish this aim, intense research on hybrid lasers, modulators and photodetectors is being done to implement optical modules and photonic integrated networks with specifications that match the market demands. Similarly, important advances on packaging and thermal management of hybrid photonic integrated circuits (PICs) are currently in progress. In this paper, we report our latest results on hybrid III-V on Si transmitters, receivers and packaged optical modules for high-speed optical communications. In addition, a review of recent advances in this field will be provided for benchmarking purposes.

III-V-on-Silicon Integration: From Hybrid Devices to Heterogeneous Photonic Integrated Circuits

An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets. This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment. This invention covers the design of the heat transfer components within the chassis of rack mounted computer server and the heat transfer system components external to the server within rack enclosure, as well as the external cooling system components necessary to connect to existing fluid based heat transfer and removal systems and processes.

High efficiency heat removal system for rack mounted computer equipment

A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat.

Interface card cooling uisng heat pipes

A method of providing utilities to a computer data center is discussed. The method includes initially connecting one or more non-evaporative cooling units to a data center as primary cooling plants, obtaining a government-issued water permit, and after obtaining the government-issued water permit, transitioning primary cooling for the data center to one or more evaporative cooling towers.

Changing data center cooling modes

Thermal management has traditionally been relegated to the last step in the design process. However, with the exponential growth in data traffic leading to ever-greater levels of component integration and ever-higher levels of energy consumption, thermal management is rapidly becoming one of the most critical areas of research within the ICT industry. Given the vast use of optics for efficient transmission of high-speed data, this paper focuses on a new thermal solution for cooling the components within pluggable optical modules. Thermally Integrated Photonics Systems (TIPS) represents a new vision for the thermal building blocks required to enable exponential traffic growth in the global telecommunications network. In the TIPS program, existing thermal solutions cannot scale to meet the needs of exponential growth in data traffic. The main barriers to enabling further growth were identified and a research roadmap was developed around a scalable and efficient integrated thermal solution. In particular, the effects of replacing inefficient materials and large macroTECs with better thermal spreaders and μTECs are investidated. In addition, new forms of μChannel cooling into the package to more efficiently remove the heat generated by the lasers and the TECs are being studied which can lead to future photonic devices that can be deployed in a vastly more dense and integrated manner to address the requirements of future telecommunication networks.

A Vision for Thermally Integrated Photonics Systems

An apparatus, method and system are provided for a modular in-frame pumped refrigerant distribution system. Specifically, a micro-channel heat exchanger is positioned in an equipment cabinet close to equipment that generates heat. More specifically, the micro-channel heat exchanger may be positioned on a) a shelf above the equipment, b) the back side of the equipment, or c) a shelf below the equipment. The micro-channel heat exchanger is operable to receive a refrigerant supplied by an external heat exchanger along a primary flow path, transfer heat from air above and/or near the equipment to a coil of the micro-channel heat exchanger, circulate the refrigerant to extract the heat, and return the refrigerant with an extracted portion of generated heat to the external heat exchanger along a secondary flow path. The external heat exchanger may remove extracted heat from a building via a building chilled water system or an outdoor condenser unit.

Modular in-frame pumped refrigerant distribution and heat removal system

An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.

A board-level heat transfer apparatus for communication platforms

An apparatus comprising a fluid-circulator loop configured to be located on a circuit board, wherein a heat-removal portion of the fluid-circulator loop is configured to be located adjacent to an optical transceiver module on the circuit board.

Apparatus for cooling board mounted optical modules

Methods, mechanisms, models and tail gas emissions of convective drying in sludge: A review.

Thermal design is in the critical path of all telecommunication equipment product development because of the steady, unabated increase in equipment power densities to satisfy the level of features, services, and performance demanded by customers. Proper thermal design contributes to the overall quality, functionality, and reliability of Alcatel-Lucent solutions and can provide a marketing advantage as a differentiator with respect to the competition. This paper describes in detail the thermal design process for a typical telecommunication equipment application in a central office environment. Experience is shared on the challenges, pitfalls, and common tools/approaches for both system-level and board-level (circuit pack) thermal design, as well as the thermal testing of prototypes.

Wei Ling

Papers

Modular in-frame pumped refrigerant distribution and heat removal system

A board-level heat transfer apparatus for communication platforms

Apparatus for cooling board mounted optical modules

Methods, mechanisms, models and tail gas emissions of convective drying in sludge: A review.

Thermal design of central office telecommunication equipment