Showing papers by "Wen-Yan Yin published in 2005"
TL;DR: An extensive study on the perfectly matched layer (PML) implementation using bilinear transform in the finite-difference time-domain (FDTD) simulation shows that with the CFS factor, the implemented SC-PML and UPML attain significantly lower relative reflection error over wide frequency range.
Abstract: This paper presents an extensive study on the perfectly matched layer (PML) implementation using bilinear transform in the finite-difference time-domain (FDTD) simulation. The bilinear transform is used to implement both the stretched coordinate PML (SC-PML) and the uniaxial PML (UPML) with the complex frequency-shifted (CFS) equations. It is shown that with the CFS factor, the implemented SC-PML and UPML attain significantly lower relative reflection error over wide frequency range with both superior in performance to the split-field PML. The FDTD algorithm incorporating these PMLs is applied to analyze wide-band responses of some complex microwave devices, including RF microelectromechanical systems switch and coplanar waveguide crossover junction.
26 citations
TL;DR: Based on some derived closed-form equations for determining the wideband frequency-dependent ohmic attenuation constant, loss tangent, and equivalent permittivity, the average power handling capabilities (APHC) are accurately characterized for some thin-film microstrip interconnects as discussed by the authors.
Abstract: Based on some derived closed-form equations for determining the wide-band frequency-dependent ohmic attenuation constant, loss tangent, and equivalent permittivity, the average power handling capabilities (APHC) are accurately characterized for some thin-film microstrip interconnects (TFMIs) on a single-layer polyimide and a microstrip on a double-layer polyimide and GaAs substrates, respectively The accuracy problem arising from some closed-form equations for calculating the ohmic attenuation constant is highlighted, and the temperature-dependent property of thermal conductivity needs to be considered in calculating the temperature rise in some substrates, such as GaAs, etc Possible ways to efficiently predict and improve the APHC are suggested, which could be useful when applying the microstrip interconnects in a high-power operating environment
19 citations
TL;DR: In this article, the average power handling capabilities (APHCs) of finite-ground thin-film microstrip lines (TFMLs) on benzocyclobutene (BCB) and polyimide films over ultra wide frequency ranges are investigated.
Abstract: Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground thin-film microstrip lines (TFMLs) on benzocyclobutene (BCB) and polyimide films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. It is believed that the proposed approach is useful in the design of practical TFML circuits.
15 citations
TL;DR: In this paper, the average power-handling capability of the signal line in finite-ground coplanar waveguides (FGCPWs) on polyimide and GaAs substrates is evaluated.
Abstract: The average power-handling capability (APHC) of the signal line in finite-ground coplanar waveguides (FGCPWs) on polyimide and GaAs substrates is evaluated in this paper. In our approach, the ohmic loss of metal lines is characterized in different ways, and the effects of an irregular edge shape are also considered. The rise in temperature of the signal line is determined by single- and double-layer thermal models, with the temperature-dependent properties of the thermal conductivity of GaAs material treated appropriately. Parametric studies are carried out to investigate the overall effects of signal-line width, thickness, conductivity, edge-shape angle, and polyimide thickness on APHC. Some possible ways to enhance the APHC of these FGCPWs are also proposed. © 2005 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2005.
12 citations
TL;DR: In this article, the design of 1D compact microstrip resonant cells (CMRCs) is presented, and several thin line arrays in the 50Ω microstrip line with special configurations are fabricated without the requirement of any additional process.
Abstract: This paper presents the design of novel 1D compact microstrip resonant cells (CMRC). Several thin line arrays in the 50Ω microstrip line with special configurations are fabricated without the requirement of any additional process. Three cells of the proposed structure can provide a wide stopband of −10 dB from 12.7 to 35.9 GHz and −30 dB from 13.8 to 35.9 GHz, respectively. This novel CMRC structure can be used for various compact and wideband microwave-circuit applications. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 45: 386–387, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20831
11 citations
TL;DR: In this article, Dawish et al. proposed a method to solve the problem of multiscale Microwaving in the context of multilayer wireless networks, which is similar to ours.
Abstract: For original paper see Dawish et al. (IEEE Trans. Microw. Theory Tech., vol. 52, no.11, p.2611-20, 2004 November).
5 citations
03 Jul 2005
TL;DR: In this article, the authors rigorously derived transfer functions for on-chip global interconnects based on distributed resistance, inductance, capacitance and conductance (RLCG) transmission line model with typical boundary conditions.
Abstract: Novel transfer functions for on-chip global interconnects are rigorously derived based on distributed resistance, inductance, capacitance and conductance (RLCG) transmission line model with typical boundary conditions The new interconnect transfer function reveals that the distributed conductance of interconnects has a severe effect on interconnect performance The peak value of voltage decreases about 50% in the case of g=033 S/m, compared with the ideal lossless case of g=0 for the finite length interconnect with an open circuit termination and an arbitrary source impedance The crosstalk between coupled interconnects is also examined and demonstrated numerically
4 citations
04 Dec 2005
TL;DR: In this paper, the capacitive coupling effects in circular stacked inductors are characterized by taking the non-overlapping between upper and bottom traces of different layers into account, which can predict self-resonant frequency (f/sub SR) for on-chip circular stacked induction devices.
Abstract: In this paper, we proposed a method to characterize the capacitive coupling effects in circular stacked inductors, which takes the non-overlapping between upper and bottom traces of different layers into account Compared with the full-wave method and the analytical method with completely overlapping assumption, our method can predict self-resonant frequency (f/sub SR/) for on-chip circular stacked inductors used in RFICs more accurately
1 citations
TL;DR: In this paper, the average power-handling capability of the signal line in finite-ground coplanar waveguides (FGCPWs) on polyimide and GaAs substrates is evaluated.
Abstract: The average power-handling capability (APHC) of the signal line in finite-ground coplanar waveguides (FGCPWs) on polyimide and GaAs substrates is evaluated in this paper. In our approach, the ohmic loss of metal lines is characterized in different ways, and the effects of an irregular edge shape are also considered. The rise in temperature of the signal line is determined by single- and double-layer thermal models, with the temperature-dependent properties of the thermal conductivity of GaAs material treated appropriately. Parametric studies are carried out to investigate the overall effects of signal-line width, thickness, conductivity, edge-shape angle, and polyimide thickness on APHC. Some possible ways to enhance the APHC of these FGCPWs are also proposed. © 2005 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2005.
1 citations
04 Dec 2005
TL;DR: In this article, the performance of on-chip CMOS transformers in the presence and absence of patterned ground shields (PGS) at temperatures of 253 K, 298 K, 333 K, and 373 K were investigated.
Abstract: Extensively comparative studies are carried out on the performance of on-chip CMOS transformers in the presence and absence of patterned ground shields (PGS) at temperatures of 253 K, 298 K, 333 K, and 373 K These transformers were fabricated using 018 micron CMOS processes and designed to be interleaved and center-tapped interleaved geometries, respectively, but with the same inner dimension, metal track width, track spacing and substrate properties Based on the two-port S-parameters measured at different temperatures, all performance indicators, such as maximum available gain Gmax, Q-factor of the primary or secondary coil, power loss, and minimum noise figure of these transformers are extracted and compared with each other
1 citations
04 Dec 2005
TL;DR: In this paper, an accurate procedure was proposed to capture the skin and proximity effect of microstrip interconnects on curved surfaces using an extended volume filament model, which can incorporate some special applications where cylindrical or even elliptic substrate must be used.
Abstract: An accurate procedure was proposed to capture the skin and proximity effect of microstrip interconnects on curved surfaces using an extended volume filament model These conformal geometries can incorporate some special applications where cylindrical or even elliptic substrate must be used Parasitic studies were performed to show the hybrid effects of all geometrical and physical parameters on the frequency-dependent distributed series resistance and inductance of these interconnects, which can be further used to predict their responses in the presence of high-power or ultra-wideband electromagnetic pulses
04 Dec 2005
TL;DR: In this paper, the average power handling capabilities (APHCs) of finite-ground TFMIs on benzocyclobutene (BCB), polyimide and LTCC films over ultra wide frequency ranges are investigated.
Abstract: Various finite-ground thin-film microstrip interconnects (TFMIs) used in the design of high-speed circuit, monolithic microwave and millimeter-wave integrated circuits are studied and compared Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground TFMIs on benzocyclobutene (BCB), polyimide and LTCC films over ultra-wide frequency ranges are investigated Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc
04 Dec 2005
TL;DR: The element-by-element technique in conjunction with preconditioned conjugate gradient (PCG) solver is adopted for fast parameter extraction of multi-layer and multi-conductor interconnects in VLSI circuit and both the memory requirement and the CPU time are significantly reduced.
Abstract: In this paper, the element-by-element technique in conjunction with preconditioned conjugate gradient (PCG) solver is adopted for fast parameter extraction of multi-layer and multi-conductor interconnects in VLSI circuit In order to partially implement parallel computation, the proposed technique takes advantage of Fortran 95 in the array manipulation, and the efficiency of this technique is verified by numerical examples Compared to some reference solutions, both the memory requirement and the CPU time are significantly reduced while maintaining a relatively high accuracy
03 Jul 2005
TL;DR: In this article, the authors used FDTD and PSTD to simulate the transient evolution of wave propagation in structures with double negative (DNG) materials, and numerical results were given to provide clear descriptions of the novel wave behaviors.
Abstract: As a full wave simulation method, the finite-difference time-domain (FDTD) method is capable of capturing the transient characteristics of wave propagation. This method has been successfully used in modeling the interactions of electromagnetic waves with double negative (DNG) materials. Another method, the pesudospectral time-domain (PSTD) method, is superior to FDTD in its linear dispersion relation. Another advantage of PSTD is that all field components are now located at a same position in the unit cell. Therefore, it is more natural to handle the boundary condition on interfaces between different materials. In this paper, FDTD and PSTD are used to simulate the transient evolution of wave propagation in structures with DNG materials. Numerical results are given to provide clear descriptions of the novel wave behaviors.