William W Gerberich

TL;DR: There are more than 200 different methods for measuring thin film adhesion, suggesting it to be material, geometry and even industry specific as discussed by the authors, suggesting that the major extrinsic variables are film stress, extent of delamination, thickness and temperature while the major intrinsic ones are modulus, yield strength, the thermodynamic work of adhesion and one or more length scales.

TL;DR: In this article, a model based upon discretized dislocations is proposed for both the initiation of yielding at an upper yield point and the arrest of the indenter at a lower yield point.

TL;DR: In this article, a superdislocation model was proposed to predict the yield point during indentation of tungsten and an iron alloy using the change in shear stress between the elastically and fully plastic loading conditions.

TL;DR: In this article, the authors show that a series of discrete yielding events separated by elastic deformation can be observed in single-crystal Au(111, Au(110, and Au(100), and that the onset of this behavior is in agreement with calculations for the theoretical shear strength of gold.

TL;DR: A cube corner indentation method was used to measure the fracture toughness of organo-silicate glass (OSG) films, which ranges from 0.01 to 0.05 MPaOm.