W
Won Yong Kim
Researcher at KITECH
Publications - 81
Citations - 794
Won Yong Kim is an academic researcher from KITECH. The author has contributed to research in topics: Microstructure & Alloy. The author has an hindex of 12, co-authored 81 publications receiving 668 citations.
Papers
More filters
Journal ArticleDOI
Stress-induced hexagonal close-packed to face-centered cubic phase transformation in commercial-purity titanium under cryogenic plane-strain compression
TL;DR: A rare transformation from a hexagonal close-packed (hcp) phase to a face-centered cubic (fcc) phase was found in pure Ti deformed by cryogenic channel-die compression indented for microstructural refinement as mentioned in this paper.
Journal ArticleDOI
Microstructure and elastic modulus of Ti¿Nb¿Si ternary alloys for biomedical applications
TL;DR: Ternary Ti-Nb-Si alloys consisting of biocompatible alloying elements have been produced to investigate the effect of alloying on microstructure and elastic modulus as discussed by the authors.
Journal ArticleDOI
Effect of V addition on microstructure and mechanical property in the Nb–Si alloy system
TL;DR: In this article, microstructure and mechanical properties of vanadium-added two-phase alloys consisting of α-Nb 5 Si 3 phase and Nb solid solution (Nb ss ) were investigated in terms of a variation of chemical composition and compression test at room temperature and at 1773 K.
Journal ArticleDOI
Stress-induced martensitic transformation of metastable β-titanium alloy
TL;DR: In this paper, the constituent phases and associated deformed microstructure of quenched Ti-Nb-nb-0.5-1.5% Si alloy were investigated to provide pseudoelasticity for biomedical and sensor applications.
Journal ArticleDOI
Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads
Hyung Giun Kim,Sang Min Kim,Lee Jae Young,Mi Ri Choi,Si Hyun Choe,Ki Hong Kim,Jae Sung Ryu,Sangshik Kim,Seung Zeon Han,Won Yong Kim,Sung Hwan Lim +10 more
TL;DR: In this paper, a comparative study on the difference in interfacial behavior of thermally aged Cu wire bonding with Al and Au pads was conducted using transmission electron microscopy, and the coherent interfaces were found to retard the growth of IMCs and a variety of orientation relationships between wire, pad and interfacial IMCs were identified.