Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices

Thermal performance of ultra-thin flattened heat pipes with composite wick structure

Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices

Experimental study of the thermal characteristics of a heat pipe

https://nottingham-repository.worktribe.com/preview/859553/Thermal%20performance%20of%20ultra-thin%20flattened%20heat%20pipes-R2.pdf

Thermal performance of ultra-thin flattened heat pipes

The utility model discloses a printed circuit board with heat pipe cooling structure, include multi -storied green sheet, inlay the last heat pipe module of green sheet, the heat pipe module includes that heat sink, heat dish establishes the heat pipe of imbibition core in and, the condensation segment of heat pipe and evaporation zone respectively with heat sink, heat dish is connected. The utility model has the advantages of simple structure, quality are light and handy, and the radiating effect is obvious, and stability is high, and it need not external drive to conduct heat, especially having superior radiating effect to the higher CPU heat dissipation problem of thermal current density, having positive and fine value at the exhibition appliance that sends out of 5G communication, simultaneously, manufacturing process is simple, can be applicable to mass production and make.

Xie Peida

Papers

Thermal performance of ultra-thin flattened heat pipes

Printed circuit board with heat pipe cooling structure