Three parallel algorithms for classical molecular dynamics are presented. The first assigns each processor a fixed subset of atoms; the second assigns each a fixed subset of inter-atomic forces to compute; the third assigns each a fixed spatial region. The algorithms are suitable for molecular dynamics models which can be difficult to parallelize efficiently—those with short-range forces where the neighbors of each atom change rapidly. They can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors. The algorithms are tested on a standard Lennard-Jones benchmark problem for system sizes ranging from 500 to 100,000,000 atoms on several parallel supercomputers--the nCUBE 2, Intel iPSC/860 and Paragon, and Cray T3D. Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems. For large problems, the spatial algorithm achieves parallel efficiencies of 90% and a 1840-node Intel Paragon performs up to 165 faster than a single Cray C9O processor. Trade-offs between the three algorithms and guidelines for adapting them to more complex molecular dynamics simulations are also discussed.

Fast parallel algorithms for short-range molecular dynamics

Hyperbranched polymers: from synthesis to applications

This article presents an overview of the developments in stainless steels made since the 1990s. Some of the new applications that involve the use of stainless steel are also introduced. A brief introduction to the various classes of stainless steels, their precipitate phases and the status quo of their production around the globe is given first. The advances in a variety of subject areas that have been made recently will then be presented. These recent advances include (1) new findings on the various precipitate phases (the new J phase, new orientation relationships, new phase diagram for the Fe–Cr system, etc.); (2) new suggestions for the prevention/mitigation of the different problems and new methods for their detection/measurement and (3) new techniques for surface/bulk property enhancement (such as laser shot peening, grain boundary engineering and grain refinement). Recent developments in topics like phase prediction, stacking fault energy, superplasticity, metadynamic recrystallisation and the calculation of mechanical properties are introduced, too. In the end of this article, several new applications that involve the use of stainless steels are presented. Some of these are the use of austenitic stainless steels for signature authentication (magnetic recording), the utilisation of the cryogenic magnetic transition of the sigma phase for hot spot detection (the Sigmaplugs), the new Pt-enhanced radiopaque stainless steel (PERSS) coronary stents and stainless steel stents that may be used for magnetic drug targeting. Besides recent developments in conventional stainless steels, those in the high-nitrogen, low-Ni (or Ni-free) varieties are also introduced. These recent developments include new methods for attaining very high nitrogen contents, new guidelines for alloy design, the merits/demerits associated with high nitrogen contents, etc.

Recent developments in stainless steels

Damascene copper electroplating for on-chip interconnections, a process that we conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition. We discuss here the relationship of additives in the plating bath to superfilling, the phenomenon that results in superconformal coverage, and we present a numerical model which accounts for the experimentally observed profile evolution of the plated metal.

Damascene copper electroplating for chip interconnections

Due to ever increasing demands on lubricants, such as increased service intervals, reduced volumes and reduced emissions, there is a need to develop new lubricants and improved wear additives. Ionic liquids (ILs) are room temperature molten salts that have recently been shown to offer many advantages in this area. The application of ILs as lubricants in a diverse range of systems has found that these materials can show remarkable protection against wear and significantly reduce friction in the neat state. Recently, some researchers have shown that a small family of ILs can also be incorporated into non-polar base oils, replacing traditional anti-wear additives, with excellent performance of the neat IL being maintained. ILs consist of large asymmetrical ions that may readily adsorb onto a metal surface and produce a thin, protective film under boundary lubrication conditions. Under extreme pressure conditions, certain IL compounds can also react to form a protective tribofilm, in particular when fluorine, phosphorus or boron atoms are present in the constituent ions.

/pdf/a-review-of-ionic-liquid-lubricants-570i9ndoqj.pdf

A Review of Ionic Liquid Lubricants

Atomic insight into tribochemical wear mechanism of silicon at the Si/SiO 2 interface in aqueous environment: Molecular dynamics simulations using ReaxFF reactive force field

Friction behavior of aqueous solution at macroscale is quite different from that at nanoscale. At macroscale, tribochemistry usually occurs between lubricant and friction surfaces in the running-in process due to a high contact pressure, and most such processes can lead to friction reduction. In the present work, we reported that the hydrogen ions in aqueous solution played an important role in tribochemistry in running-in process (friction reducing process), which could result in the friction coefficient reducing from 0.4 to 0.04 between Si3N4 and glass surfaces at macroscale. It is found that the running-in process and low friction state are closely dependent on the concentration of hydrogen ions in the contact region between the two friction surfaces. The lubrication mechanism is attributed to tribochemical reaction occurring between hydrogen ions and surfaces in the running-in process, which forms an electrical double layer and hydration layer to lower friction force. Finally, the running-in process o...

Tribochemistry and superlubricity induced by hydrogen ions.

Ionic liquids are generally considered as environmentally friendly material. The film thicknesses of ionic liquids and silicone oils at high pressures up to 3 GPa are measured employing the relative optical interference intensity method. The results show that for the three ionic liquids the relative order of film thickness is 1-octyl-3-methylimidazolium hexafluorophosphate ([OMIM]PF6) > 1-hexyl-3-methylimidazolium hexafluorophosphate ([HMIM]PF6) > 1-butyl-3-methylimidazolium hexafluorophosphate ([BMIM]PF6). In elastohydrodynamic lubrication the order of viscosity can simply account for this fact. In thin film lubrication condition the length of alkyl side chain and arrangement manner of cation are used to explain the experimental results. Another remarkable phenomenon is that even though the viscosities of silicone oils are close to those of ionic liquids, the measured film thicknesses of silicone oils are quite less than those of the ionic liquids. The results show that long alkyl chain ionic liquid can form rather thick films at high pressure.

Film Thickness of Ionic Liquids Under High Contact Pressures as a Function of Alkyl Chain Length

Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

Molecular dynamics simulations of nanoscratching processes were used to study the atomic-scale removal mechanism of single crystalline silicon in chemical mechanical polishing (CMP) process and particular attention was paid to the effect of scratching depth. The simulation results under a scratching depth of 1 nm showed that a thick layer of silicon material was removed by chip formation and an amorphous layer was formed on the silicon surface after nanoscratching. By contrast, the simulation results with a depth of 0.1 nm indicated that just one monoatomic layer of workpiece was removed and a well ordered crystalline surface was obtained, which is quite consistent with previous CMP experimental results. Therefore, monoatomic layer removal mechanism was presented, by which it is considered that during CMP process the material was removed by one monoatomic layer after another, and the mechanism could provide a reasonable understanding on how the high precision surface was obtained. Also, the effects of the...

Xinchun Lu

Papers

Atomic insight into tribochemical wear mechanism of silicon at the Si/SiO 2 interface in aqueous environment: Molecular dynamics simulations using ReaxFF reactive force field

Tribochemistry and superlubricity induced by hydrogen ions.

Film Thickness of Ionic Liquids Under High Contact Pressures as a Function of Alkyl Chain Length

Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study