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Yan Qi
Researcher at University of Toronto
Publications - 3
Citations - 116
Yan Qi is an academic researcher from University of Toronto. The author has contributed to research in topics: Temperature cycling & Creep. The author has an hindex of 3, co-authored 3 publications receiving 113 citations.
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Journal ArticleDOI
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
TL;DR: Three conditions with two ramp rates and two temperature ranges were applied to resistor 2512 and PBGA 256 test vehicles assembled with SnPb and Pb-free solders, showing that the higher ramp rate reduced the testing time while retaining the same failure modes, and that the damage per cycle increased with the temperature difference.
Journal ArticleDOI
Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle Parameters
TL;DR: In this paper, thermomechanical finite element (FE) models were used to analyze the stress/strain response of a resistor test vehicle during ATC testing under three accelerated test conditions: two ramp rates (14 degC/min and 95 degC /min) and two temperature ranges (DeltaT=0degC-100degC and -40degC −125degC), denoted 14-100 (ramp rate-temperature range), 95-100, and 95-165).
Journal ArticleDOI
Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate
Yan Qi,A. R. Zbrzezny,M. Agia,Rex Lam,Hamid R. Ghorbani,Polina Snugovsky,Doug D. Perovic,Jan K. Spelt +7 more
TL;DR: In this article, leadless chip resistor (LCR) assemblies were manufactured using both traditional tin-lead (Sn37Pb) and lead-free (Sn3.8Ag0.7Cu) solders, which were then exposed to accelerated thermalcycling (ATC) tests between 0°C and 100°C with a 10−14°C/min ramp rate and a 5min dwell time.