Y
Yoshihito Osada
Researcher at Hokkaido University
Publications - 144
Citations - 11772
Yoshihito Osada is an academic researcher from Hokkaido University. The author has contributed to research in topics: Self-healing hydrogels & Polyelectrolyte. The author has an hindex of 42, co-authored 144 publications receiving 10731 citations. Previous affiliations of Yoshihito Osada include Ibaraki University & Tokyo Institute of Technology.
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Journal ArticleDOI
Double‐Network Hydrogels with Extremely High Mechanical Strength
Journal ArticleDOI
A polymer gel with electrically driven motility
TL;DR: In this paper, the authors describe a chemomechanical system of this sort based on a synthetic polymer gel, which is anionic, and positively charged surfactant molecules can therefore bind to its surface, inducing local shrinkage by decreasing the difference in osmotic pressure between the gel interior and the solution outside.
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High Mechanical Strength Double‐Network Hydrogel with Bacterial Cellulose
Atsushi Nakayama,Akira Kakugo,Jian Ping Gong,Yoshihito Osada,Mitsuo Takai,Tomoki Erata,Shin Kawano +6 more
TL;DR: Double‐network (DN) hydrogels with high mechanical strength have been synthesized using the natural polymers bacterial cellulose and gelatin, and an enhancement in the mechanical strength was also observed for the combination of BC with polysaccharides, such as sodium alginate, gellan gum, and ι‐carrageenan.
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Soft and Wet Materials: Polymer Gels
Yoshihito Osada,Jian Ping Gong +1 more
TL;DR: In this paper, unique electrical, thermal, and chemical responses of polymer gels are described and recently observed frictional specificities of gels were also briefly introduced, showing that a polymer gel shows a variety of stimuli-responsive actions, responding to external environmental changes.
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Novel hydrogels with excellent mechanical performance
TL;DR: Three kinds of novel hydrogels with excellent mechanical performance have been developed, based on different concepts, and one has a high modulus (sub-megapascal), with a failure compressive stress as high as 20 MPa, through a double network structure.