Showing papers by "Zhong Chen published in 1999"

Mechanical patterning of a device layer

Abstract: A method of fabricating a device comprising mechanically patterning a device layer using a stamp containing the desired pattern. The device layer is formed on a plastic or polymeric substrate. The stamp is pressed against the substrate under a load which patterns the device layer without cracking it in the non-patterned areas.

Characterizing the interfacial fracture toughness for microelectronic packaging

Abstract: In a microelectronic package there are many interfaces where the adhesion between different materials plays an important role in its reliability issue. Take an example in a flipchip package: delamination at the interfaces between underfill/passivation, underfill/substrate, etc. will lead to the speeded breakdown of the interconnection. Proper characterization of interfacial adhesion strength is very important for process control as well as reliability prediction. From a fracture mechanics point of view, a strained body with defects will break when the rate of change in its potential energy G reaches a critical value G e (toughness). In this paper both analytical and experimental descriptions are given on the determination of G e using single cantilever beam (SCB) specimens. A composite beam on an elastic foundation model is employed to interpret the testing results once the modulus of the foundation is known. The modulus of the foundation can be estimated by analytical approach or deduced from the experimental record. The approach described in our paper is generically suitable for many more interfacial toughness determinations.

Study on spectral emission characteristics of infrared lamps

Abstract: The spectral characteristics at wavelength ranges of 0.35-0.85 microm and 1.72-16.7 microm (5800-600 cm(-1)) for both domestic and imported infrared lamps used in scientific research, industry, medical service, home electrical appliance etc. have heen studied and compared. This paper has provided the theoreical and experimental bases for their applications and improvement in designs, technology of manufacture, quality and performance.