The review renders a short background on the research work carried out on epoxy clay nanocomposites Clays are one of the ideal nano reinforcements for polymers because of their high intercalation chemistry and aspect ratio Epoxy clay nanocomposites are finding vast applications in various industries like aerospace, defense, automobile, etc The physical and chemical properties of the epoxy systems are influenced by the processing techniques, clay modifier and curing agents used for the preparation of nanocomposites The clay morphology (intercalation/exfoliation) of the nanocomposites is also depended on the above parameters So the emphasis of the present work is to highlight these parameters on morphology and the final mechanical, thermal and barrier properties of the nanocomposites The proposed applications of the epoxy clay nanocomposites are also discussed

Epoxy clay nanocomposites ― processing, properties and applications: A review

Enhanced mechanical properties of silanized silica nanoparticle attached graphene oxide/epoxy composites

Fracture toughness and water uptake of high-performance epoxy/nanoclay nanocomposites

Toughening epoxies with halloysite nanotubes

Intercalation strategies in clay/polymer hybrids

Epoxy–clay nanocomposites were prepared by the dispersion of an organically modified layered clay in an epoxy resin (diglycidyl ether of bisphenol A) and curing in the presence of methyl tetrahydro acid anhydride at 80–160°C. The nanometer-scale dispersion of layered clay within the crosslinked epoxy-resin matrix was confirmed by X-ray diffraction and transmission electron microscopy, and the basal spacing of the silicate layer was greater than 100–150 A. Experiments indicated that the hydroxyethyl groups of the alkyl ammonium ions, which were located in the galleries of organically modified clay, participated in the curing reaction and were directly linked to the epoxy-resin matrix network. Experimental results showed that the properties of epoxy were improved, evidently because of the loading of organically modified clay. The impact strength and tensile strength of the nanocomposites increased by 87.8 and 20.9%, respectively, when 3 wt % organic clay was loaded, and this demonstrated that the composites were toughened and strengthened. The thermal-decomposition and heat-distortion temperatures were heightened in comparison with those of pure epoxy resin, and so were the dynamic mechanical properties, including the storage modulus and glass-transition temperature. Moreover, experiments showed that most properties of the composites were ameliorated with low clay contents. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2649–2652, 2004

Preparation and characterization of modified‐clay‐reinforced and toughened epoxy‐resin nanocomposites

A photosensitive polysiloxaneimide precursor was synthesized from oxydianiline, bis(p-aminophenoxy)dimethylsilane, and a diacid chloride. This diacid chloride was prepared by the reaction of thionyl chloride with a diacid, which resulted from the reaction of pyromellitic dianhydride with hydroxyethylacrylate in N-methylpyrrolidone (NMP). The adhesion properties between polyimide and substrates such as SiO2 wafer were improved with introduction of siloxane moiety into the polyimide chain. The dielectric constant decreased with increasing siloxane moiety content. The photocrosslinking reaction results show that an 88–90% gel fraction was reached under the irradiation of a high-pressure mercury lamp. © 1995 John Wiley & Sons, Inc.

Preparation and characterization of negative photosensitive polysiloxaneimide

Photosensitive copolysiloxaneimides were prepared by adding a photosensitive monomer such as hydroxyethylacrylate (HEA) to copolyisoimides, which were synthesized by the copolycondensation of pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride with oxydianiline, and bis(p-aminophenoxy) dimethylsiloxane. The forming process of isoimide rings caused by the reaction of polyamic acid with dicyclohexylcarbodiimide and the disappearance process of isoimide rings caused by the reaction of copolyisoimide with HEA were monitored in situ by infrared approach. A series of photosensitive copolysiloxaneimides films were prepared, and the desired structure-properties relationships about inherent viscosities, thermal expansion coefficient, thermal stability and glass transition temperature, dielectric constants, moisture absorption, and photosensitivity were also discussed. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 1463–1468, 1997

Synthesis and characterization of photosensitive copolysiloxaneimides

This article describes the preparation of a kind of auto-photosensitive polyimide (PSPI) that contains organo-silicone moiety in its main chain. A group of novel auto-photosensitive polyimides were prepared based on the aromatic diamine monomers and 3,3′,5,5′-benzophenontetracarboxylic dianhydride (BTDA) by the method of solution polycondensation at room temperature and imidized at a high temperature. The properties of PSPIs, such as ultraviolet (UV) absorption, electric and adhesion properties, and moisture absorption, were characterized by UV analysis, a dielectric constant detector, and so on. The relationship between the structure and properties of PSPIs is discussed. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 943–947, 2000

Modification of negative auto‐photosensitive polyimide

In this article, a polyimide precursor was synthesized from oxydianiline and a diacid chloride. This diacid chloride was prepared by the reaction of thionyl chloride with a diacid, which resulted from the reaction of pyromellitic dianhydride with cinnamyl alcohol in N-methylpyrrolidone (NMP). The photoresist, made from the above polyimide precursor, was spincoated onto silicon wafers, prebaked, and then exposed to UV light with a high pressure Hg lamp. The pattern generation process was also investigated. The appropriate conditions of the photolithographic procedures, involving photoresist compounding, spin coating, prebaking, exposure, development, rinse, postbaking, etc., were determined. The experimental results show that the photoresist exhibited excellent thermal stability and adequate photosensitivity.

Zuobang Li

Papers

Preparation and characterization of modified‐clay‐reinforced and toughened epoxy‐resin nanocomposites

Preparation and characterization of negative photosensitive polysiloxaneimide

Synthesis and characterization of photosensitive copolysiloxaneimides

Modification of negative auto‐photosensitive polyimide

Preparation of negative photoreactive polyimide and its characterization