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Fig. 8 Contours of the condenser-side surface temperature for the (a) vapor chamber and (b) solid copper spreader at device heat inputs of approximately 1 W (left) and 2 W (right). Note the different temperature scales.
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Journal Article
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DOI
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A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
[...]
Gaurav Patankar
1
,
Simone Mancin
1
,
Justin A. Weibel
1
,
Suresh V. Garimella
1
,
Mark MacDonald
2
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+1 more
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Institutions (2)
Purdue University
1
,
Intel
2
01 Mar 2016
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Journal of Electronic Packaging