Patent
Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
Levi A. Campbell,Richard C. Chu,Michael J. Ellsworth,Madhusudan K. Iyengar,Vinod Kamath,Robert E. Simons +5 more
TLDR
In this paper, the authors present an apparatus for the immersion cooling of an electronic subsystem having multiple different types of components to be immersion-cooled, which includes a container sized to receive the electronic subsystem, and a coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container.Abstract:
Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.read more
Citations
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Patent
Case and rack system for liquid submersion cooling of electronic devices connected in an array
TL;DR: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system is presented in this paper, where a manifold system is used to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases.
Patent
Liquid submersion cooling system
TL;DR: In this article, a self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat generating components is presented.
Patent
Cooled electronic system
TL;DR: In this article, a sealed module, cooled electronic system and method are described relating to cooling a heat generating electronic device, which is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid.
Patent
Electronic module with pump-enhanced, dielectric fluid immersion-cooling
TL;DR: In this paper, a pump-enhanced, dielectric fluid immersion-cooling of an electronic device is described, where the dielectrics are in direct contact with the electronic device and the pump is an impingement cooling, immersed pump.
Patent
Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks
TL;DR: In this paper, a cooling system and a method for facilitating cooling of a liquid-cooled electronics rack is presented, which includes a coolant flow controller, a modular cooling unit and a pressure controller.
References
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PatentDOI
Smart cooling of data centers
TL;DR: In this paper, a cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center.
Patent
Cooling system and method
TL;DR: In this paper, a system for cooling a data center includes a plurality of cooling racks, with each cooling rack including a housing and cooling system components supported by the housing, and the system further includes a fluid communication system coupled to the cooling component components of the plurality of racks.
Patent
Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
TL;DR: In this article, a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of an electronics rack is presented for facilitating cooling of an EH rack.
Patent
High heat flux evaporative spray cooling
TL;DR: In this article, a spray cooling system for cooling one or more heat sources is described, where at least one atomizer array is arranged in an array to deliver a fine spray across a wide distribution to impinge upon the surface to be cooled.
Patent
Cooling system for an electronic circuit device
Yamamoto Haruhiko,Masahiro Suzuki,Yoshiaki Udagawa,Mitsuhiko Nakata,Koji Katsuyama,Izumi Ono,Kikuchi Shunichi +6 more
TL;DR: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or lowmelting point metal for establishing thermal contact between the transfer plate and the circuit component as mentioned in this paper.