Patent
Apparatus for wafer probing having surface level sensing
TLDR
In this article, a method and apparatus to improve the capabilities of automatic and semi-automatic diode, integrated chip, and wafer probers is presented, which is accomplished through an electronic logic circuit triggered by electrical contact of the probe as opposed to a mechanical sensor.Abstract:
Disclosed is a method and apparatus to improve the capabilities of automatic and semi-automatic diode, integrated chip, and wafer probers Prober contact with the upper surface of the wafer to be tested is accomplished through an electronic logic circuit triggered by electrical contact of the probe as opposed to a mechanical sensor This improved surface position signal is supplied to additional digital logic circuitry to operate a vertical axis control mechanism which precisely locates the probes relative to the wafers that will be tested Thus, prober contacts with test wafers are positively and accurately made improving the reliability of the test stage of wafer productionread more
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Patent
Wafer probe station having environment control enclosure
TL;DR: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment.
Patent
Apparatus and methods for semiconductor wafer testing
TL;DR: An automatic system for sheet resistivity testing on surface layers of semiconductor wafers, including a wafer handling stage having a platform for carrying a semiconductor Wafer, and an arrangement for mounting the platform for rotation about a central axis and for translation of the platform orthogonal to a major surface thereof, is presented in this paper.
Patent
Control system for automated parametric test equipment
TL;DR: In this article, a control system and methodology for defining and executing parametric test sequences using automated test equipment is presented, where the control system is divided into components which separate fixed, reusable information from information which is specific to particular tests.
Patent
Collinear four-point probe head and mount for resistivity measurements
TL;DR: An improved resistivity probe comprised of a rigid strip of electrically nonconducting material having a number of metallic, generally parallel pins coupled thereto can be mounted in a vertically shiftable probe head in any suitable manner as discussed by the authors.
Patent
Electronic device test handler
TL;DR: In this paper, a plurality of carriers, each for carrying a set of electronic devices, cyclically conveyed in a close loop from a loading stage where electronic devices are loaded onto the carriers, through a pre-test chamber, such as a "soak" chamber, from the pre test chamber to a test stage where the devices are preferably lifted from the carrier to come into contact with a test head contactor for testing, from test stage to a post-test chambers such as an un-soak chamber, through the post-testing chamber to an unloading stage where
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Patent
High speed precision chuck assembly
TL;DR: In this paper, a multiphase stepping motor is used to drive the chuck plate through the bearing-eccentric assembly, the motor including optical limit switches sensing the motor shaft position and controlling the motor operation.
Patent
Probe head-probing machine coupling adaptor
TL;DR: Probe head adaptor assembly for mounting a multi-point electrical test probe head with a probing machine to test miniature electronic devices is described in this article, which includes a main adaptor ring configured for engagement to a probe machine, a removable ring clamp engageable to the main adaptors, a pin aligning ring within and coaxial with the adaptors and carrying a plurality of compressible electrically conductive pins positioned to make interface contact with terminals of said probe head.
Patent
Low impedance fixed point test probe
TL;DR: In this paper, a test probe includes a picture frame insulator support member on which relatively short cantilever beam-like members are mounted, and one end of each of the beamlike members is used as a probe to contact a beam lead or bonding pad of an integrated circuit chip which is part of a semiconductor wafer.