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Articles Comprising Nanoscale Patterns With Reduced Edge Roughness and Methods of Making Same

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TLDR
In this paper, an article comprising a nanoscale surface pattern, such as a grating, is provided with a nano-scale patterns of reduced edge and/or sidewall roughness.
Abstract
In accordance with the invention, an article comprising a nanoscale surface pattern, such as a grating, is provided with a nanoscale patterns of reduced edge and/or sidewall roughness. Smooth featured articles, can be fabricated by nanoimprint lithography using a mold having sloped profile molding features. Another approach uses a mold especially fabricated to provide smooth sidewalls of reduced roughness, and a third approach adds a post-imprint smoothing step. These approaches can be utilized individually or in various combinations to make the novel articles.

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Citations
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Step and repeat imprint lithography processes

TL;DR: In this article, a template is brought into contact with the liquid and the cured liquid includes an imprint of any patterns formed in the template, and the remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.
Patent

Scatterometry alignment for imprint lithography

TL;DR: In this paper, a template is brought into contact with the liquid and the liquid is cured, including an imprint of any patterns formed in the template, and alignment of the template with a previously formed layer on a substrate, in one embodiment, is accomplished by using scatterometry.
Patent

Alignment systems for imprint lithography

TL;DR: In this paper, the imprint head is configured to hold a template in a spaced relation to a substrate and a light source that applies activating light to cure the activating light curable liquid.
Patent

A method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability

TL;DR: In this paper, a method for arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer is presented.
Patent

A method of forming stepped structures employing imprint lithography

TL;DR: In this article, a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate is presented.
References
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Method of manufacturing a thin-film pattern on a substrate

TL;DR: In this article, an improvement in a thin-film pattern manufacturing method is presented, in which the mask is manufactured by forming a layer of an organic resin on the thin film on the substrate and by forming the organic resin layer in the desired pattern by a mechanical forming member.
Patent

Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method

TL;DR: In this article, a method and a device for providing (replicating) a patterned resyntetic resin relief (37) on the surface of a glass substrate was described.
Patent

Process for forming a lithographic mask

TL;DR: In this paper, a patterned layer of a polymeric material on a substrate for the lithographic processing thereof is provided; a layer of polymeric materials is formed on the substrate, embossed to form a pattern of peaks and valleys and dry etched to remove the residual polymer material in the valleys, thereby exposing a portion of the substrate surface.
Patent

Procedure for fabrication of microstructures over large areas using physical replication

TL;DR: An improved replication process which copies a master pattern onto an intermediate transfer mask which is then used to form a lithographic mask on the surface of a substrate is described in this article.
Patent

Simultaneous moulding and transfer printing

TL;DR: A printing method for molded plastics articles comprises printing of selected indicia onto an elastomeric film (2), locating the printed film in a mould cavity (3) with the printed surface facing inwardly and then evacuating the air space between the film and the mould surface (8) as mentioned in this paper.