Patent
Cooling device for heating element
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TLDR
In this article, a cooling device is used for heat dissipation of power electronic devices, and is used to take dissipation heat generated during the operation of the power electronics devices away from surfaces of the heating elements, so as to enable surface temperature fluctuate in a reasonable range.Abstract:
The utility model discloses a cooling device for heating elements, and relates to a thermal design technology, a liquid phase-change heat transfer technology, a pool boiling heat transfer technology, a metal material machine shaping technology and a metal surface processing technology. The heating device of the utility model is formed by the combination of a heat transfer main part (1) which serves both as an evaporator and a condenser and has a rectangular cross section, and packaging plates (2, 3). A novel cooling device is formed after the combination. The cooling device is used for heat dissipation of power electronic devices, and is used to take dissipation heat generated during the operation of the power electronic devices away from surfaces of the heating elements, so as to enable surface temperature of the power electronic devices to fluctuate in a reasonable range. The cooling device in high in heat dissipation potential, and by using the cooling device, heat dissipation requirements of the electronic elements under a high heat flux can be met.read more
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