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Proceedings ArticleDOI

Damage Characterization in Copper Deformed under Hydrostatic Stress — Experimental Analysis

Philip Flater, +3 more
- Vol. 845, Iss: 1, pp 721-724
TLDR
The results of an experimental investigation designed to determine the effect of damage created by hydrostatic tensile loading on the properties of half-hard OFHC copper are reported in this article.
Abstract
The results of an experimental investigation designed to determine the effect of damage created by hydrostatic tensile loading on the properties of copper are reported. Three metallurgical conditions of half‐hard OFHC copper were investigated; as worked; annealed 2hr at 400°C (∼40 micron grain diameter); and annealed 2hr at 800°C (∼80 micron grain diameter). Mechanical property characterization included uniaxial compression tests. High rate plasticity and damage was introduced by Taylor and rod‐on‐rod impact tests. The damage from the high rate experiments was characterized using optical and scanning electron microscopy. Quasi‐static compression specimens machined from recovered high rate samples were tested to determine the influence of damage on the mechanical response of the material. The compression test results will be discussed in relationship to the starting microstructure and the extent of damaged introduced into the material.

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Citations
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Grain size and pressure effects on spall strength in copper

TL;DR: In this article, the effects of specific microstructural features on the spall behavior of 99.999% copper were evaluated using a 35mm single/two-stage light gas gun.
References
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Journal ArticleDOI

Ductile damage evolution under triaxial state of stress: theory and experiments

TL;DR: In this article, the authors used the continuum damage mechanics (CDM) model formulation proposed by [Eng.Mech. Mech. 58(1/2) (1997) 11] against ductile damage evolution experimentally measured in A533B low alloy steel under various stress triaxiality conditions.
Journal ArticleDOI

The effect of void growth on Taylor cylinder impact experiments

TL;DR: The constitutive model used to simulate the growth of voids was developed and implemented into an explicit, two-dimensional, finite-element computer code as discussed by the authors, which provided good qualitative comparison with experimental data.
Proceedings ArticleDOI

Grain Size and Pressure Effects on Spall Strength in Copper

TL;DR: In this paper, the effects of specific microstructural features on the spall behavior of 99.999% copper were evaluated using a 35mm single/two-stage light gas gun.
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